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Patents Assigned to Seoul National University of Technology Center for Industry Cllaboration

METHOD FOR MEASURING ADHESIVE STRENGTH OF THIN FILM USING DISPERSION CHARACTERISTICS OF SURFACE WAVES, AND COMPUTER-READABLE RECORDING MEDIUM HAVING PROGRAM FOR PERFORMING SAME RECORDED THEREON

Publication number: 20200217820

Abstract: Disclosed are a method for measuring the adhesive strength of a thin film using surface waves, and a computer-readable recording medium having a program for performing same recorded thereon. The method for measuring the adhesive strength of a thin film measures the adhesive strength between a substrate and a thin film by means of an electronic calculator, using sound waves measured from a thin film structure having a thin film formed on a substrate.

Type: Application

Filed: September 14, 2018

Publication date: July 9, 2020

Applicant: Seoul National University of Technology Center for Industry Cllaboration

Inventors: Ik Keun PARK, Tae Sung PARK, Yu Min CHOI, Dong Ryul KWAK