Abstract: Preparation methods of an anisotropic conductive adhesive film are provided. One of the preparation methods includes heating a solid-state light-curing resin, a solid-state thermosetting resin and a solid-state elastomer to form a mixture. A liquid-state light curing active monomer and plasticizer are added to the mixture. A leveling agent, antioxidant and insulating nanoparticles are added separately to the mixture. Conductive particles are added to the mixture. A light curing agent, latent heat curing agent and coupling agent are added to the mixture to produce a light-beat dual curing anisotropic conductive adhesive. The conductive adhesive is coated on a plastic film base material to form a semi-finished product. The semi-finished product is cured and dried to form a cured conductive adhesive layer, so that an anisotropic conductive adhesive film is produced. The anisotropic conductive adhesive layer is cut, and the anisotropic conductive adhesive film is rolled.