Patents Assigned to Shibaura Electronics Co., Ltd.
  • Patent number: 10533898
    Abstract: To provide an infrared temperature sensor that is corrected in detected temperature while ensuring high responsiveness. An infrared temperature sensor 10 according to the present invention includes a heat conversion film 40, an infrared detection element 43 held by the heat conversion film 40, a temperature compensation element 45 that is provided adjacently to the infrared detection element 43 and is held by the heat conversion film 40, a light guide part 59 that guides entered infrared rays toward the infrared detection element 43, and a blocking part 27 that blocks the infrared rays from being incident on the temperature compensation element 45, in which an inner surface of the light guide part 59 configures an irradiation surface 57 to be irradiated with the infrared rays, and the irradiation surface 57 includes a correction region 58 that is different in emissivity of the infrared rays from surroundings.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: January 14, 2020
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Jun Kanaya, Tatsuya Konno
  • Patent number: 10505286
    Abstract: A sensor element includes: an element body including, for example, a thermistor; paired lead wires drawn out from the element body; and stranded wires that are each obtained by twisting a plurality of core wires and are joined to the respective paired lead wires in a welding region. The welding region includes a main joining region provided in a predetermined region in an axis direction, and sub joining regions adjacent to the main joining region, and joining strength of each of the lead wires and the corresponding stranded wire is higher in the main joining region than in the sub-joining region.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: December 10, 2019
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Tatsuyuki Suzuki, Naoki Tsuneta, Ryohei Takada
  • Patent number: 10436648
    Abstract: To provide a temperature sensor that can be attached to or removed from a neutral line without skilled technique, a temperature sensor is attached to a rectangular coil and detects temperature of the coil. The temperature sensor includes: a sensor holder extending from front end side toward back end side; a sensor body that is held by the sensor holder to locate a thermosensitive device on the front end side and from which lead wires are drawn toward the back end side, the lead wires being electrically connected to the thermosensitive device; and a clip that is fixed to the sensor holder and presses the coil against the sensor body by elastic force.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: October 8, 2019
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Takamasa Yoshihara, Michiru Takemura
  • Patent number: 10156483
    Abstract: A temperature sensor that includes a resin coating layer and is high in temperature detection accuracy is provided. The temperature sensor is provided with a resin coating layer that covers: an element body; and connection parts at which lead-out wires are respectively connected to lead wires. The resin coating layer includes an inner layer and an outer layer. The inner layer seals the element body and the connection parts, and is formed of PFA. The outer layer is disposed around the inner layer, and is formed of PTFE that has heat shrinkability and a melting point higher than a melting point of PFA. The outer layer has a rectangular-parallelepiped appearance shape and has a flat outer surface.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: December 18, 2018
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Takamasa Yoshihara, Michiru Takemura
  • Publication number: 20170016777
    Abstract: A temperature sensor that includes a resin coating layer and is high in temperature detection accuracy is provided. The temperature sensor is provided with a resin coating layer that covers: an element body; and connection parts at which lead-out wires are respectively connected to lead wires. The resin coating layer includes an inner layer and an outer layer. The inner layer seals the element body and the connection parts, and is formed of PFA. The outer layer is disposed around the inner layer, and is formed of PTFE that has heat shrinkability and a melting point higher than a melting point of PFA. The outer layer has a rectangular-parallelepiped appearance shape and has a flat outer surface.
    Type: Application
    Filed: December 17, 2014
    Publication date: January 19, 2017
    Applicant: Shibaura Electronics Co., Ltd.
    Inventors: Takamasa YOSHIHARA, Michiru TAKEMURA
  • Patent number: 9322718
    Abstract: An object of the present invention is to provide a temperature sensor which can increase responsiveness while ensuring reliability and can be downsized without changing its mounting configuration from conventional ones. In a temperature sensor 10, two thermistors 20A and 20B are held in a protective tube 11 via holders 30. Flat portions 30b are formed on the holders 30, and a filler 60 can be spread throughout the protective tube 11 through spaces 40 between an inner circumferential surface of the protective tube 11 and the flat portions 30b as well as spaces 50 between the inner circumferential surface of the protective tube 11 and lateral portions 30c. Also, in the protective tube 11, element bodies 21 of the thermistors 20A and 20B are placed side by side close to the inner circumferential surface of the protective tube 11.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: April 26, 2016
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Atsushi Takahashi, Naohiko Takaku, Wataru Isobe
  • Patent number: 9176443
    Abstract: An infrared temperature sensor including: a sensor case made of metal and including a first airspace (a light guiding region) that guides infrared rays entering from an infrared entrance window, and a second airspace (a light shielding region) that is adjacent to the light guiding region via a partition wall, and where an upper wall that blocks entrance of the infrared rays is formed on an entrance side of the infrared rays; a film that absorbs the infrared rays reaching the film through the light guiding region, and converts the infrared rays to heat; a sensor cover that is made of metal and arranged opposing the sensor case via the film; an infrared detection element and a temperature compensation element arranged on the film, wherein the light guiding region and the light shielding region have substantially symmetrical forms with respect to the partition wall.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: November 3, 2015
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Noriyuki Nakayama, Morihisa Hamada, Tatsuya Konno, Shingo Maruyama
  • Patent number: 9066372
    Abstract: A heating cooking device includes a temperature sensing element that contacts a bottom surface of a top plate directly or indirectly and measures a temperature of the top plate, a spring portion one end side of which is supported by a heater unit and the other end side of which presses the temperature sensing element against the top plate, and a spring that presses the heater unit toward the top plate. An elastic force n1 with which the spring portion presses the temperature sensing element against the top plate is smaller than an elastic force n2 with which the spring presses the heater unit toward the top plate.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: June 23, 2015
    Assignee: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Noriyuki Nakayama, Morihisa Hamada, Hiroshi Misumi
  • Publication number: 20140140712
    Abstract: An infrared temperature sensor including: a sensor case made of metal and including a first airspace (a light guiding region) that guides infrared rays entering from an infrared entrance window, and a second airspace (a light shielding region) that is adjacent to the light guiding region via a partition wall, and where an upper wall that blocks entrance of the infrared rays is formed on an entrance side of the infrared rays; a film that absorbs the infrared rays reaching the film through the light guiding region, and converts the infrared rays to heat; a sensor cover that is made of metal and arranged opposing the sensor case via the film; an infrared detection element and a temperature compensation element arranged on the film, wherein the light guiding region and the light shielding region have substantially symmetrical forms with respect to the partition wall.
    Type: Application
    Filed: January 24, 2014
    Publication date: May 22, 2014
    Applicant: SHIBAURA ELECTRONICS, CO., LTD.
    Inventors: Noriyuki Nakayama, Morihisa Hamada, Tatsuya Konno, Shingo Maruyama
  • Publication number: 20130208765
    Abstract: An object of the present invention is to provide a temperature sensor which can increase responsiveness while ensuring reliability and can be downsized without changing its mounting configuration from conventional ones. In a temperature sensor 10, two thermistors 20A and 20B are held in a protective tube 11 via holders 30. Flat portions 30b are formed on the holders 30, and a filler 60 can be spread throughout the protective tube 11 through spaces 40 between an inner circumferential surface of the protective tube 11 and the flat portions 30b as well as spaces 50 between the inner circumferential surface of the protective tube 11 and lateral portions 30c. Also, in the protective tube 11, element bodies 21 of the thermistors 20A and 20B are placed side by side close to the inner circumferential surface of the protective tube 11.
    Type: Application
    Filed: July 14, 2011
    Publication date: August 15, 2013
    Applicant: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Atsushi Takahashi, Naohiko Takaku, Wataru Isobe
  • Publication number: 20130186881
    Abstract: A heating cooking device includes a temperature sensing element that contacts a bottom surface of a top plate directly or indirectly and measures a temperature of the top plate, a spring portion one end side of which is supported by a heater unit and the other end side of which presses the temperature sensing element against the top plate, and a spring that presses the heater unit toward the top plate. An elastic force n1 with which the spring portion presses the temperature sensing element against the top plate is smaller than an elastic force n2 with which the spring presses the heater unit toward the top plate.
    Type: Application
    Filed: October 5, 2010
    Publication date: July 25, 2013
    Applicant: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Noriyuki Nakayama, Morihisa Hamada, Hiroshi Misumi
  • Patent number: 8419275
    Abstract: Provided is a temperature sensor capable of stably keeping the accuracy of detected temperatures. The temperature sensor of the present invention comprises a sensor element (1) comprising a temperature sensing element (2) whose electrical resistance changes according to temperature; a pair of lead wires (4) electrically connected to the temperature sensing element (2); and a covering material (5) which seals the temperature sensing element (2) and portions of the lead wires (4) in a prescribed range; wherein the lead wires (4) are led out of the sealed ends (6) of the covering material (5). The temperature sensor further comprises a metallic protective tube (20) which houses the sensor element (1) except part of the lead wires (4); and a shield comprising a ceramic sealed end closing element (7) which encloses the sealed ends (6), and a lead wire protective tube (8). The shield is loosely fitted inside the metallic protective tube (20).
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: April 16, 2013
    Assignee: Shibaura Electronics Co., Ltd.
    Inventors: Noriyuki Nakayama, Kazumasa Nakamura, Hiroshi Misumi, Terukazu Koike
  • Publication number: 20130077653
    Abstract: A temperature sensor excellent in durability under a high-pressure atmosphere of hydrogen is provided. The temperature sensor includes a thermistor element body comprising an oxide sintered body, a pair of lead wires each electrically connected to the element body and comprising Pt or a Pt alloy, and a sealing glass sealing the element body and a part of the lead wires including a portion connected to the element body. The pair of lead wires comprising any of Pt, an alloy comprising Pt and one or two of Ir and Pd, and an alloy of Pd and Ir, and the temperature sensor is used under an atmosphere of hydrogen.
    Type: Application
    Filed: June 27, 2012
    Publication date: March 28, 2013
    Applicant: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Kazuto KOSHIMIZU, Takayuki NAKAYA, Satoshi UCHIYAMA
  • Publication number: 20120063488
    Abstract: Provided is a temperature sensor capable of stably keeping the accuracy of detected temperatures. The temperature sensor of the present invention comprises a sensor element (1) comprising a temperature sensing element (2) whose electrical resistance changes according to temperature; a pair of lead wires (4) electrically connected to the temperature sensing element (2); and a covering material (5) which seals the temperature sensing element (2) and portions of the lead wires (4) in a prescribed range; wherein the lead wires (4) are led out of the sealed ends (6) of the covering material (5). The temperature sensor further comprises a metallic protective tube (20) which houses the sensor element (1) except part of the lead wires (4); and a shield comprising a ceramic sealed end closing element (7) which encloses the sealed ends (6), and a lead wire protective tube (8). The shield is loosely fitted inside the metallic protective tube (20).
    Type: Application
    Filed: March 18, 2010
    Publication date: March 15, 2012
    Applicant: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Noriyuki Nakayama, Kazumasa Nakamura, Hiroshi Misumi, Terukazu Koike
  • Publication number: 20060014404
    Abstract: A sensor is provided with a sensing unit for generating electrical signals responding to a physical quantity, multiple terminals for an electrical connection with an external, multiple signal wires for transmitting the electrical signals to the terminals, a connector housing where the terminals are accommodated, and an electrically isolating case, to which the terminals are fixed. The terminals and the electrically isolating case are inserted into the connecter housing. Thus, the connecter housing can be singly formed without being insert-molded. Accordingly, the manufacture performance of the sensor can be improved.
    Type: Application
    Filed: July 15, 2005
    Publication date: January 19, 2006
    Applicants: Denso Corporation, Shibaura Electronics Co., Ltd.
    Inventors: Yota Iwamoto, Yoshinobu Takeuchi, Susumu Shibayama, Takamasa Yoshihara, Kaname Kato, Takeru Yamashita
  • Patent number: 6880969
    Abstract: In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: April 19, 2005
    Assignees: Denso Corporation, Shibaura Electronics Co., Ltd.
    Inventors: Tomohiro Adachi, Atsushi Kurano, Kazuto Koshimizu, Norihiko Shimura, Takamasa Yoshihara