Patents Assigned to Shikoku Chemicals Corporation
  • Publication number: 20190153363
    Abstract: A stabilized solid bleaching agent which has good solubility in water without undergoing the occurrence of foaming and without generating residues has been demanded. The present invention provides a stabilized solid-bleaching-agent-containing material having a coating layer formed therein, wherein the coating layer contains at least one component selected from the group consisting of an alkali metal salt of an aromatic carboxylic acid, an alkali metal salt of a non-cyclic dicarboxylic acid, an alkali metal salt of a non-cyclic monocarboxylic acid having 1 to 7 carbon atoms and mixtures thereof.
    Type: Application
    Filed: April 21, 2017
    Publication date: May 23, 2019
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Akihiro NORIMOTO, Koichi SAHIRO, Tsuyoshi TOYOTA, Yoshiya IWASAKI
  • Patent number: 10030023
    Abstract: The invention provides a mercaptoalkylglycoluril represented by the general formula (I): wherein R1 and R2 each independently represent a hydrogen atom, a lower alkyl group, or a phenyl group; R3, R4, and R5 each independently represent a hydrogen atom or a mercaptoalkyl group selected from a mercaptomethyl group, a 2-mercaptoethyl group, and a 3-mercaptopropyl group; and n is 0, 1, or 2. The invention further provides an epoxy resin composition comprising an epoxy resin and the mercaptoalkylglycoluril, and a method for producing a laminate or a multilayer printed circuit board using the same.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: July 24, 2018
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takeshi Kumano, Takuma Takeda, Noboru Mizobe
  • Patent number: 10000622
    Abstract: The invention provides a glycoluril represented by the general formula (Z): wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R1 and R2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R3, R4 and R5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R3, R4 and R5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: June 19, 2018
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takeshi Kumano, Takuma Takeda, Syozo Miura, Takashi Kashiwabara, Noboru Mizobe
  • Publication number: 20180051038
    Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.
    Type: Application
    Filed: March 10, 2016
    Publication date: February 22, 2018
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Akikazu MATSUDA, Naoto OKUMURA, Takeshi KUMANO
  • Patent number: 9688704
    Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: June 27, 2017
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shozo Miura, Takayuki Murai, Naoto Okumura, Miya Tanioka, Masato Katsumura, Noriaki Yamaji
  • Patent number: 9649713
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: May 16, 2017
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • Publication number: 20170064823
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko HIRAO, Noriaki YAMAJI, Masato NAKANISHI, Takayuki MURAI
  • Patent number: 9532493
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: December 27, 2016
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • Publication number: 20160368935
    Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
    Type: Application
    Filed: June 30, 2014
    Publication date: December 22, 2016
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shozo MIURA, Takayuki MURAI, Naoto OKUMURA, Miya TANIOKA, Masato KATSUMURA, Noriaki YAMAJI
  • Publication number: 20160297951
    Abstract: The invention provides a glycoluril represented by the general formula (Z): wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R1 and R2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R3, R4 and R5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R3, R4 and R5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.
    Type: Application
    Filed: November 25, 2014
    Publication date: October 13, 2016
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takeshi KUMANO, Takuma TAKEDA, Syozo MIURA, Takashi KASHIWABARA, Noboru MIZOBE
  • Publication number: 20160289237
    Abstract: The invention provides a mercaptoalkylglycoluril represented by the general formula (I): wherein R1 and R2 each independently represent a hydrogen atom, a lower alkyl group, or a phenyl group; R3, R4, and R5 each independently represent a hydrogen atom or a mercaptoalkyl group selected from a mercaptomethyl group, a 2-mercaptoethyl group, and a 3-mercaptopropyl group; and n is 0, 1, or 2. The invention further provides an epoxy resin composition comprising an epoxy resin and the mercaptoalkylglycoluril, and a method for producing a laminate or a multilayer printed circuit board using the same.
    Type: Application
    Filed: November 28, 2014
    Publication date: October 6, 2016
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takeshi KUMANO, Takuma TAKEDA, Noboru MIZOBE
  • Patent number: 9200145
    Abstract: The present invention relates to a coupling agent for rubber/carbon black, containing a sulfide compound represented by the following chemical formula (I): (in the formula, each A represents O, S, NH or NR; each R represents a linear or branched alkyl or alkenyl group having 1 to 6 carbon atoms, or a cyclic alkyl or alkenyl group having 3 to 6 carbon atoms, and when A is NR, the plurality of R's on a condensed aromatic heterocyclic ring may be the same as or different from each other; n represents an integer from 1 to 6; and x represents an integer from 1 to 4).
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: December 1, 2015
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Yukiharu Shirakawa, Takeshi Masuda
  • Publication number: 20150189748
    Abstract: The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom.
    Type: Application
    Filed: May 30, 2013
    Publication date: July 2, 2015
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shusaku Iida, Takayuki Murai, Hirohiko Hirao
  • Publication number: 20140155541
    Abstract: The present invention relates to a coupling agent for rubber/carbon black, containing a sulfide compound represented by the following chemical formula (I): (in the formula, each A represents O, S, NH or NR; each R represents a linear or branched alkyl or alkenyl group having 1 to 6 carbon atoms, or a cyclic alkyl or alkenyl group having 3 to 6 carbon atoms, and when A is NR, the plurality of R's on a condensed aromatic heterocyclic ring may be the same as or different from each other; n represents an integer from 1 to 6; and x represents an integer from 1 to 4).
    Type: Application
    Filed: July 20, 2012
    Publication date: June 5, 2014
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Yukiharu Shirakawa, Takeshi Masuda
  • Publication number: 20140131080
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: May 23, 2012
    Publication date: May 15, 2014
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • Publication number: 20140097231
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: May 23, 2012
    Publication date: April 10, 2014
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • Patent number: 8378116
    Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: February 19, 2013
    Assignee: Shikoku Chemicals Corporation
    Inventors: Hirohiko Hirao, Yoshimasa Kikukawa, Takayuki Murai
  • Publication number: 20120199385
    Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
    Type: Application
    Filed: April 17, 2012
    Publication date: August 9, 2012
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Yoshimasa Kikukawa, Takayuki Murai
  • Patent number: 8183386
    Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: May 22, 2012
    Assignee: Shikoku Chemicals Corporation
    Inventors: Hirohiko Hirao, Yoshimasa Kikukawa, Takayuki Murai
  • Patent number: 7754105
    Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: July 13, 2010
    Assignee: Shikoku Chemicals Corporation
    Inventors: Hirohiko Hirao, Yoshimasa Kikukawa, Takayuki Murai