Abstract: A stabilized solid bleaching agent which has good solubility in water without undergoing the occurrence of foaming and without generating residues has been demanded. The present invention provides a stabilized solid-bleaching-agent-containing material having a coating layer formed therein, wherein the coating layer contains at least one component selected from the group consisting of an alkali metal salt of an aromatic carboxylic acid, an alkali metal salt of a non-cyclic dicarboxylic acid, an alkali metal salt of a non-cyclic monocarboxylic acid having 1 to 7 carbon atoms and mixtures thereof.
Abstract: The invention provides a mercaptoalkylglycoluril represented by the general formula (I): wherein R1 and R2 each independently represent a hydrogen atom, a lower alkyl group, or a phenyl group; R3, R4, and R5 each independently represent a hydrogen atom or a mercaptoalkyl group selected from a mercaptomethyl group, a 2-mercaptoethyl group, and a 3-mercaptopropyl group; and n is 0, 1, or 2. The invention further provides an epoxy resin composition comprising an epoxy resin and the mercaptoalkylglycoluril, and a method for producing a laminate or a multilayer printed circuit board using the same.
Abstract: The invention provides a glycoluril represented by the general formula (Z): wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R1 and R2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R3, R4 and R5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R3, R4 and R5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.
Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.
Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
Abstract: The invention provides a glycoluril represented by the general formula (Z): wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R1 and R2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R3, R4 and R5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R3, R4 and R5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.
Abstract: The invention provides a mercaptoalkylglycoluril represented by the general formula (I): wherein R1 and R2 each independently represent a hydrogen atom, a lower alkyl group, or a phenyl group; R3, R4, and R5 each independently represent a hydrogen atom or a mercaptoalkyl group selected from a mercaptomethyl group, a 2-mercaptoethyl group, and a 3-mercaptopropyl group; and n is 0, 1, or 2. The invention further provides an epoxy resin composition comprising an epoxy resin and the mercaptoalkylglycoluril, and a method for producing a laminate or a multilayer printed circuit board using the same.
Abstract: The present invention relates to a coupling agent for rubber/carbon black, containing a sulfide compound represented by the following chemical formula (I): (in the formula, each A represents O, S, NH or NR; each R represents a linear or branched alkyl or alkenyl group having 1 to 6 carbon atoms, or a cyclic alkyl or alkenyl group having 3 to 6 carbon atoms, and when A is NR, the plurality of R's on a condensed aromatic heterocyclic ring may be the same as or different from each other; n represents an integer from 1 to 6; and x represents an integer from 1 to 4).
Abstract: The present invention is a copper film-forming agent containing a copper complex composed of a copper formate and a 5-membered or 6-membered nitrogen-containing heterocyclic compound having from 1 to 3 nitrogen atoms, in which the nitrogen-containing heterocyclic compound has one or two ring structures, the total number of carbon atoms contained in a substituent is from 1 to 5, and an element other than a carbon atom in the compound is not bonded to a hydrogen atom.
Abstract: The present invention relates to a coupling agent for rubber/carbon black, containing a sulfide compound represented by the following chemical formula (I): (in the formula, each A represents O, S, NH or NR; each R represents a linear or branched alkyl or alkenyl group having 1 to 6 carbon atoms, or a cyclic alkyl or alkenyl group having 3 to 6 carbon atoms, and when A is NR, the plurality of R's on a condensed aromatic heterocyclic ring may be the same as or different from each other; n represents an integer from 1 to 6; and x represents an integer from 1 to 4).
Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
Abstract: A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux.