Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
Type:
Grant
Filed:
July 10, 2014
Date of Patent:
May 5, 2015
Assignees:
Shimane Prefectural Government, Shimane Electronic Imafuku Works Co., Ltd.
Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).
Type:
Application
Filed:
December 21, 2012
Publication date:
May 2, 2013
Applicants:
Shimane Electronic Imafuku Works Co., Ltd., Shimane Prefectural Government
Inventors:
Shimane Prefectural Government, Shimane Electronic Imafuku Works Co., Ltd.