Abstract: A phenolic resin/silicone resin hybrid compound is obtained by effecting hydrolytic condensation of an organooxysilane in the co-presence of a phenolic resin. The hybrid compound is used as the base polymer in a resist for endowing a resist film with excellent adhesion to a metal substrate.

Abstract: A sheet-testing apparatus including kneading rolls, a frame feeder, sheet applicator, foreign material detector, a frame with a light transparent window and a cutter for cutting a sheet. A sheet-testing sample-making apparatus has a cluster of kneading rolls, frame feeder, and sheet applicator. A sheet thickness detection apparatus outputs an electric signal to a memory. A kneading apparatus has a pair of heating rolls separated by a gap. The directions and speeds of rotations of the rolls are adjustable. A sensor detects the gap and a bank sensor detects the condition of a bank in the gap. The distance between the rolls, their temperatures, rotations, and speeds are automatically controlled. A pair of blades peel a sheet from the sheet-winding roll. Material dropped through the gap between the heating rolls is returned to a point above the gap. A cutting device has a length of wire sprung onto a rolled sheet to sever the sheet.

Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

Abstract: Dimethylchlorosilane and a triorganochlorosilane of the formula: R.sup.1 R.sup.2 R.sup.3 SiCl wherein R.sup.1, R.sup.2, and R.sup.3 are independently selected from monovalent hydrocarbon groups are concurrently prepared by reacting dimethyldichlorosilane with a SiH bond-containing silane compound of the formula: R.sup.1 R.sup.2 R.sup.3 SiH in the presence of a Lewis acid catalyst. The method is especially effective for concomitant preparation of dimethylchlorosilane and trimethylchlorosilane or t-butyldimethylchlorosilane in an inexpensive, simple, safe manner and in high yields.

Abstract: Liquid crystalline organopolysiloxane is provided having the general formula:R.sub.a (A).sub.b (B).sub.c SiO.sub.(4-a-b-c)/2wherein R is independently selected from the group consisting of a hydrogen atom, hydrocarbon group having i to 4 carbon atoms, and phenyl group, A is a group of the formula: ##STR1## wherein m, n, and x are integers in the range: m.gtoreq.3, n.gtoreq.2, 5.ltoreq.m+nx.ltoreq.15, x=1 or 2, B is an organic chromophore group having an absorption peak in the visible spectrum, a, b, and c are numbers in the range: 1.ltoreq.a<2, 0<b+c.ltoreq.1, 0.45.ltoreq.b(b+c).ltoreq.0.95, and 1<a+b+c.ltoreq.3. This organopolysiloxane as a high molecular weight liquid crystal is combined with a low molecular weight liquid crystal to form a liquid crystal composition.

Abstract: An organopolysiloxane composition comprising (A) a linear, alkenyl-containing, fluorinated organopolysiloxane, (B) a cyclic fluorinated organosiloxane as a tackifier, (C) an organohydrogenpolysiloxane having at least two hydrogen atoms attached to a silicon atom in a molecule, and (D) a platinum group metal catalyst has excellent properties inherent to fluorinated silicone rubber, and cures into products having adhesion and close contact to various materials including metals, glass and resins.

Abstract: The invention provides a novel chloro-terminated polysilane of the formula:Cl[(R.sup.1 R.sup.2 Si).sub.n (R.sup.3 R.sup.4 Si).sub.m ].sub.k Cl(1)wherein R.sup.1, R.sup.2 and R.sup.3 are alkyl and aryl groups, R.sup.4 is a monovalent hydrocarbon group having 2 to 12 carbon atoms selected from substituted and unsubstituted alkyl and aryl groups, n, m and k are numbers in the range: 0.ltoreq.n.ltoreq.10, 0<m.ltoreq.10, n+m.gtoreq.10, and k.gtoreq.1, especially k.gtoreq.5. It is prepared by exposing a high-molecular weight polysilane in chlorinated hydrocarbon to ultraviolet radiation in an inert gas atmosphere.

Abstract: A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin containing 1 to 10% by weight of a glycidyl naphthol derivative, (B) a naphthalene ring-bearing phenolic resin containing 1 to 10% by weight of a naphthol derivative, and (C) an inorganic filler wherein the content of the naphthol derivatives is 1 to 5% by weight based on the total resin components is suitable for encapsulating semiconductor devices since the composition has a good moldability and cures into a product having a low coefficient of expansion, heat resistance and low moisture absorption.

Abstract: There is disclosed a method for preparing a polysilane oligomer having a terminal SiH group represented by the structural formula (1): ##STR1## wherein R.sup.1 to R.sup.4 are monovalent hydrocarbon groups with proviso that at least one of R.sup.1 to R.sup.4 is an aryl group, n and m are integers of 1 or more, and n+m is equal to 3, 4, 5 or 6 comprising the step of reacting a disilane of the structural formula (2): ##STR2## wherein R.sup.1 to R.sup.4 are as defined above in the presence of a Group VIII transition metal complex catalyst.

Abstract: Novel organic silicon compounds are based on a benzene ring having two epoxy radicals and an alkoxysilane radical. They are useful as resin modifiers, adhesive aids for epoxy resins, and silane coupling agents. Inorganic fillers such as silica surface treated with the compounds are useful in encapsulating resin compositions.

Abstract: A primer composition has blended therein an organic silicon compound having in a molecule at least one group of the formula: ##STR1## wherein R.sup.1 is a monovalent hydrocarbon group or a group represented by QSi( R.sup.4 O).sub.a (R.sup.5).sub.3-a, Q is a divalent organic group, R.sup.4 and R.sup.5 each are a monovalent hydrocarbon group, a is an integer of 0 to 3, R.sup.2 and R.sup.3 each are a hydrogen atom or a monovalent hydrocarbon group, and n is 0, 1 or 2. The primer composition is a useful adhesive since it is effective for joining silicone elastomers and similar adherends to supports such as paint coated metals and resins.

Abstract: The invention provides terminally reactive polysilanes of the formula: ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are independently alkyl groups or aryl groups, X is a hydrogen or alkenyl group, n, m and k are 0.ltoreq.n.ltoreq.10, 0.ltoreq.m.ltoreq.10, n+m.gtoreq.10, and k.gtoreq.1, especially hydrosiloxy or alkenylsiloxy-terminated polysilanes. They are prepared by reacting hydroxy-terminated polysilanes with dialkylhydrochlorosilanes, alkylarylhydrochlorosilanes, dialkylalkenylchlorosilanes or alkylarylalkenylchlorosilanes in the presence of amine.

Abstract: A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

Abstract: The invention provides a novel chloro-terminated polysilane of the formula:Cl[(R.sup.1 R.sup.2 Si)n (R.sup.3 R.sup.4 Si)m]kCl (1)wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are alkyl and aryl groups, n, m and k are numbers in the range: 0.ltoreq.n.ltoreq.10, 0.ltoreq.m.ltoreq.10, n+m.gtoreq.10, and k.gtoreq.1, especially k.gtoreq.5. It is prepared by exposing a high-molecular weight polysilane in chlorinated hydrocarbon to ultraviolet radiation in an inert gas atmosphere.

Abstract: Adhesive compositions of this invention are characterized by the addition of certain silane compounds as adhesion promoters to addition curing type compositions which comprise a diorganopolysiloxane containing alkenyl groups bonded to silicon atoms and an organohydrogen polysiloxane containing hydrogen atoms bonded to silicon atoms, wherein the adhesion promoting silane compound, is of the formula: ##STR1## wherein R.sup.1 and R.sup.2 are either hydrogen atoms or lower alkyl groups, R.sup.3 and R.sup.4 are preferably lower alkyl groups and a and n are integers from 0 to 2.

Abstract: A polysilylethylene arylene polymer having an alkoxy or aryloxy group as a side chain substituent is used to form optical fiber cores which do not significantly increase their light transmission loss under an external pressure applied thereto even when exposed to a humid condition.

Abstract: In a light transmissive epoxy resin composition comprising (A) an epoxy resin and (B) a curing agent are blended (C) an organic phosphorus anti-discoloring agent and (D) silica-titania glass beads surface treated with an organic silicon compound. The composition restrains coloring in composition form and discoloration in cured form while curing into clear low stressed products having high light transmittance. Optical semiconductor devices encapsulated with the cured epoxy resin composition are reliable.

Abstract: Organic silicon compounds of formula (1) are novel: ##STR1## In the formula, R.sup.1, R.sup.2 and R.sup.3 are monovalent C.sub.1-8 hydrocarbon group, R.sup.4 is a C.sub.1-6 alkyl group, R.sup.5 is a C.sub.2-6 alkylene group or a C.sub.2-6 alkylene group containing at least one --C--O--C-- linkage, Rf is a C.sub.1-12 perfluoroalkylene or perfluorocyclo-alkylene group or a C.sub.1-12 perfluoroalkylene or perfluorocycloalkylene group containing at least one --C--O--C-- linkage, and n is 1, 2 or 3. The organic silicon compounds are useful source materials for the manufacture of fluorinated polysiloxanes having solvent resistance, chemical resistance and release property.

Abstract: Novel siloxane compounds are provided which have 1-5 hydrogen atoms each attached to a silicon atom (SiH group) and 1-5 epoxy or alkoxy - containing organic groups each attached to a silicon atom in a molecule. These siloxane compounds are useful tackifiers to conventional resins, have good affinity to fluorinated silicone resins and rubbers so that they impart adhesion to fluorinated silicone resins and rubbers, and contribute to solvent resistance and minimal moisture permeability.

Abstract: The invention provides a high-sensitivity ultraviolet-curable organopolysiloxane composition suitable for use as a surface-release treatment of various substrate such as release-paper sheets and the like. The composition comprises, as the essential ingredients, (a) an organopolysiloxane having a viscosity in the range from 50 to 3000 centipoise at 25.degree. C. and containing, in a molecule, at least one (meth)acryloxy-substituted monovalent hydrocarbon group or at least one epoxy- or glycidyloxy-substituted monovalent hydrocarbon group, and (b) a sulfonate compound such as 2-hydroxy-3-oxy-2,3-diphenylpropyl methanesulfonate as the photopolymerization initiator. The sensitivity of the composition to photopolymerization can be further increased by the addition of a specific salt such as sodium hexafluoroantimonate and sodium hexafluorophosphate.