Patents Assigned to Shinhan Diamond Industrial Co., Ltd.
  • Patent number: 8100997
    Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: January 24, 2012
    Assignee: Shinhan Diamond Industrial Co., Ltd.
    Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim
  • Publication number: 20070151554
    Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.
    Type: Application
    Filed: February 4, 2005
    Publication date: July 5, 2007
    Applicant: SHINHAN DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim
  • Publication number: 20050193866
    Abstract: The present invention relates to a cutting wheel with blanks which reduces vibration and frictional noise generated when a workpiece such as stone, steel concrete, asphalt, metal, ceramic, or wood is cut, and a method for manufacturing the same. There is provided a cutting wheel of which a wheel body is formed with at least one blank. The blank is shaped in a line with a variable width, and the blank is filled with noise absorbing material. According to the present invention, the noise and vibration is considerably decreased as compared with a general plane type cutting wheel and a conventional cutting wheel with blanks. In addition, the cutting wheel with blanks according to the present invention can absorb the noise and vibration as good as the sandwich type cutting wheel, and particularly, is considerably high in strength, and is inexpensive to manufacture with ½ to ? costs compared with the sandwich type cutting wheel.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 8, 2005
    Applicant: SHINHAN DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Jong Woo, Hwan Lee, Eung Kwon, Seo Pyun, Mun Park, Sang Lee, Jae Jeong, Shin Kim
  • Patent number: 6460532
    Abstract: A diamond cutting wheel is disclosed. The cutting wheel is capable of reducing frictional resistance, maximizing cutting efficiency, preventing the formation of chippings and discharging cut chips effectively, by means of a plurality of depressions formed on its cutting tip and the continued cutting surfaces of the cutting tip. The cutting wheel comprises a core disk and a sintered cutting tip. The sinter is fitted around and welded to the circumferential end of the core disk. A plurality of depressions are formed on the upper and lower cutting surfaces of the cutting tip while being spaced apart from one another. The depressions formed on the upper cutting surface alternate with the depressions formed on the lower cutting surface so as to allow the cutting surfaces to be continued.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: October 8, 2002
    Assignee: Shinhan Diamond Industrial Co. Ltd.
    Inventor: Kuk Seob Park
  • Patent number: D446529
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: August 14, 2001
    Assignee: Shinhan Diamond Industrial Co., Ltd.
    Inventor: Kuk Seob Park