Abstract: An electronic device includes a first wiring substrate having a first corner part, a first ground pattern formed on a lower surface of the first wiring substrate with avoiding the first corner part, a second ground pattern formed on an upper surface of the first wiring substrate with avoiding the first corner part, a second wiring substrate provided above the first wiring substrate and including a second corner part above the first corner part, a third ground pattern formed on a lower surface of the second wiring substrate with avoiding the second corner part, a fourth ground pattern formed on an upper surface of the second wiring substrate with avoiding the second corner part, a plurality of terminals electrically connected to each of the first, second, third and fourth ground patterns, and an antenna fixed to the upper surface of the second wiring substrate at the second corner part.

Abstract: A wiring board to be used with being mounted on a packaging board includes a chip component surface-mounted on a surface facing the packaging board. The chip component includes terminal electrodes at both end portions of the component body thereof. Each of the terminal electrodes is provided in a form in which a plated film (Sn) formed on the surface of the terminal electrode is separated into two portions, one portion being on the wiring board side, and another portion being on the packaging board side. In one aspect, each of the terminal electrodes of the chip component is separated into a portion on the wiring board side and a portion on the packaging board side, and the plated film (Sn) is formed on a surface of each of the separated portions of each of the terminal electrodes.

Abstract: An inductor includes a core substrate including minute column-like electrical conductors extending between a front surface and a back surface of the core substrate. Each column-like electrical conductor is insulated from adjacent column-like electrical conductors by being surrounded by an insulating material. Insulation layers are formed on the front surface and the back surface of the core substrate, respectively. At least two connection electrical conductors extend through each of the insulation layers. Each connection electrical conductor is electrically connected to a plurality of the column-like electrical conductors. Wirings are formed on each of the insulation layers to connect said connection electrical conductors to each other electrically. The wirings, the connection electrical conductors and the column-like electrical conductors are connected to form a coil in a three-dimensional manner.

Abstract: Method for manufacturing a semiconductor device wherein thin semiconductor chips having a thickness of 50 ?m or so are imbedded and mounted inside a package, and multi-level stacking is facilitated by forming external connection terminals on both surfaces of the package, or, alternatively, exposing the terminal formation portions of the wiring pattern, to which the external conncetion terminals are to be connected, out of a solder resist layer.

Abstract: A housing preform consisting of a plate member formed to be bendable in which are formed electronic components and an interconnect electrically connecting the electronic components. The plate member is formed into a shape of the housing unfolded flat. The housing can be formed by folding the plate member. Due to this, it is possible to provide an electronic apparatus comprised of a housing in which electronic components are mounted.

Abstract: A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.

Abstract: The present invention provides a method of data processing for calculating and storing in a memory to deform a data structure of layout designing data in which cells having geometry information and also having reference information to refer to geometry information of another cell are hierarchically combined with each other.

Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

Abstract: A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.