Abstract: Disclosed are compositions useful for the pretreatment of polymeric material to be removed from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for pretreating polymer residues from plasma etch processes. Also disclosed are methods of removing such pretreated polymeric material.
Type:
Application
Filed:
May 25, 2001
Publication date:
December 13, 2001
Applicant:
Shipley Company, L.L.C. of Marlborough, Massachusetts