Abstract: A method of packing a semisolid compound into a bag comprising the steps of precooling a high temperature semisolid compound to such a temperature at which it can maintain the desired viscosity, filling said precooled semisolid compound into a packing bag made of synthetic resin while cooling its outer surface with water, heat-sealing an opening part of the bag, putting the bag in a water tank for cooling, removing the cooled bag and transporting it, and an apparatus for carrying out the above-described method.