Abstract: A secondary-battery current collector comprising an aluminum foil and a film containing an ion-permeable compound and carbon fine particles formed thereon or a secondary-battery current collector comprising an aluminum foil, a film containing an ion-permeable compound and carbon fine particles formed thereon as the lower layer, and a film containing a binder, carbon fine particles and a cathodic electroactive material formed thereon as the upper layer, a production method of the same, and a secondary battery having the current collector are provided.

Abstract: Catalysts of the present invention are not corroded in acidic electrolytes or at high potential and have excellent durability and high oxygen reducing ability. The catalyst includes a metal oxycarbonitride containing two metals M selected from the group consisting of tin, indium, platinum, tantalum, zirconium, titanium, copper, iron, tungsten, chromium, molybdenum, hafnium, vanadium, cobalt, cerium, aluminum and nickel, and containing zirconium and/or titanium.

Abstract: A magnetic recording medium used for the thermally assisted magnetic recording system which fires a laser beam at a magnetic recording medium to partially heat the medium and applies a magnetic field from the outside to the part heated to lower the coercivity for recording. The magnetic recording medium is configured by a glass substrate on which a heat radiation layer, heat retention layer, intermediate layer, and recording layer are stacked. Further, the heat retention layer is configured by a member having an effective refractive index lower than the effective refractive index of the recording layer and having an temperature diffusion coefficient determined by the specific heat, density, and heat conductivity rate higher than glass and lower than metal. The material with a high temperature diffusion coefficient is used lowered in temperature diffusion coefficient using a porous structure or granular structure.

Abstract: A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.

Abstract: An allyl acetate production catalyst comprising at least (a) palladium, (b) gold, (c) a compound containing at least one element selected from copper, nickel, zinc and cobalt, (d) an alkali metal salt compound and (e) a carrier, is produced by a process comprising step 1 in which a homogeneous solution of a palladium-containing compound and a gold-containing compound is supported on a carrier by contact therewith, step 2 in which the carrier obtained in step 1 is contacted with an alkali solution for impregnation, step 3 in which the carrier obtained in step 2 is subjected to reduction treatment, and step 4 in which a compound containing at least one element selected from copper, nickel, zinc and cobalt and an alkali metal salt compound are supported onto the carrier obtained in step 3. The obtained allyl acetate production catalyst has minimal reduction in activity and improved selectivity, when used for production of allyl acetate from propylene, oxygen and acetic acid.

Abstract: A transfer material that can favorably form a fine pattern by nanoimprinting. The nanoimprinting transfer material is a fine pattern resin composition that includes an organosilicon compound and a metal compound of a metal from groups 3 through 14 of the periodic table.

Abstract: A method for producing an RE-containing alloy represented by formula R(T1?xAx)13?y (wherein R represents Ce, etc.; T represents Fe, etc.; and A represents Al, etc; 0.05?x?0.2; and ?1?y?1) including a melting step of melting alloy raw materials at 1,200 to 1,800° C.; and a solidification step of rapidly quenching the molten metal produced through the above step, to thereby form the first RE-containing alloy, wherein the solidification step is performed at a cooling rate of 102 to 104° C./second, as measured at least within a range of the temperature of the molten metal to 900° C.; and an RE-containing alloy, which is represented by a compositional formula of RrTtAa (wherein R and A represent the same meaning as above, T represents Fe, etc.; 5.0 at. %?r?6.8 at. %, 73.8 at. %?t?88.7 at. %, and 4.6 at. %?a?19.4 at. %) and has an alloy microstructure containing an NaZn13-type crystal structure in an amount of at least 85 mass % and ?-Fe in an amount of 5-15 mass % inclusive.

Abstract: There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble resin comprising either or both (A1) a carboxyl group-containing epoxy (meth)acrylate or (A2) a carboxyl group-containing urethane (meth)acrylate obtained by reacting an epoxy resin with two or more epoxy groups in the molecule (a), an unsaturated group-containing monocarboxylic acid (b) and a polybasic acid anhydride (c), (B) a compound having an ethylenic unsaturated group in the molecule, (C) a photopolymerization initiator, (D) a phosphorus-containing epoxy resin having a specific structure and (E) a hydrated metal compound. The composition of the invention can be suitably used as a solder resist or cover lay film for an FPC.

Abstract: A method of manufacturing a brazed pipe comprises steps A to D. In the step A, on an upper surface of the right-hand side edge portion of a material plate 20 having a brazing material layer over opposite surfaces thereof, a first slant surface 21 is formed such that it inclines from the upper side toward the lower side while approaching the right end, and a first flat surface 22 is formed between the first slant surface 21 and the lower surface. In the step B, on a lower surface of the left-hand side edge portion of the material plate 20, a second slant surface 24 is formed such that it inclines from the lower side toward the upper side while approaching the left end, and a second flat surface 25 is formed between the second slant surface 24 and the lower surface.

Abstract: The present invention is an alloy lump for R-T-B type sintered magnets, including an R2T14B columnar crystal and an R-rich phase (in which R is at least one rare earth element including Y, T is Fe or Fe with at least one transition metal element except for Fe, and B is boron or boron with carbon), in which in the as-cast state, R-rich phases nearly in the line-like or rod-like shape (the width direction of the line or rod is a short axis direction) are dispersed in the cross section, and the area percentage of the region where R2T14B columnar crystal grains have a length of 500 ?m or more in the long axis direction and a length of 50 ?m or more in the short axis direction is 10% or more of the entire alloy.

Abstract: Horizontally continuously cast aluminum alloy rods excellent in quality are efficiently manufactured using a melting/holding furnace (101) to produce molten aluminum alloy, a molten-metal treatment apparatus (201) to remove aluminum oxide and hydrogen gas from the molten aluminum alloy, a horizontally continuously casting apparatus (301) to cast the treated molten aluminum alloy into horizontally continuously cast aluminum alloy rods, a cutting machine (408A, 408B) to cut to a standard length the cast rods, a first straightening apparatus (1001) to straighten bend of the cut rods, a peeling apparatus (1101) to peel skin portions of the straightened rods, a nondestructive inspection apparatus (1401) to inspect surface and internal portions of the peeled rods, a sorting apparatus (1501) to sort the inspected rods judged non-defective based on results of the nondestructive inspection step and a packing apparatus to pack the sorted rods, and continuously using at least the first straightening apparatus (1001) et

Abstract: This invention relates to a novel polymer compound, and a process for preparing the same and a radical polymerizable, curable composition using the same. The polymer of the invention has in the side chain thereof a structure represented by the formula (1): wherein R1 each independently represents at least one or more organic residue selected from the group consisting of an alkylene group, a branched alkylene group, a cycloalkylene group, an aralkylene group and an arylene group, R2 each independently represents at least one or more organic residue selected from the group consisting of an alkylene group, a branched alkylene group, an alkenylene group, a branched alkenylene group, a cycloalkylene group, a cycloalkenylene group and an arylene group, and n represents an integer of 0 to 20.

Abstract: An ultrafine mixed-crystal oxide, wherein the oxide has a change in absorbance of about 5 (/hr) or less when measured in such a manner that said oxide is dispersed at a concentration of 0.067% in a solvent of a 98% glycerin in which Sunset Yellow is dissolved at a concentration of 0.02%, thereby preparing a dispersion, and the dispersion is irradiated with a BLB lamp (ultraviolet light) with an intensity of 1.65 mW/cm2 to obtain said change in absorbance (?OD) at 490 nm.

Abstract: An object of the present invention is to provide a method for producing a compound semiconductor device wafer, which method enables cleaving of a wafer with precision and at remarkably high yield, attains high process speed, and improves productivity. The inventive method for producing a compound semiconductor device wafer, the wafer including a substrate and a plurality of compound semiconductor devices provided on the substrate and arranged with separation zones being disposed between the compound semiconductor devices, comprises a step of forming separation grooves, through laser processing, on the top surface of the substrate (i.e., surface on the compound semiconductor side) at the separation zones under the condition that a compound semiconductor layer is present on the top surface of the substrate.

Abstract: A barium calcium titanate of the present invention has a remarkable effect that a fine barium calcium titanate powder having excellent dispersibility, reduced impurities and high crystallinity and being solid-dissolved at an arbitrary ratio, and a production process thereof are provided. The barium calcium titanate represented by the compositional formula: (Ba(1-X)CaX)YTiO3 (wherein 0<X<0.2 and 0.98?Y?1.02), which contains 3 mol % or less (including 0 mol %) of an orthorhombic perovskite compound and in which the specific surface area D is from 1 to 100 m2/g.

Abstract: The present invention provides particulate titanium oxide and a production process thereof.