Abstract: A high-speed printing device is provided with a particle trap (30), arranged in the paper channel in the paper transport direction upstream of the printing area (15, 49), for intercepting particles, i.e. paper clips, entrained with he recording carrier (12). The particle trap has a passage slot (95), which is dimensioned to correspond to the size of the particles to be intercepted, for the recording carrier (12).

Abstract: Method and circuit arrangement for generating a sinusoidal line AC voltage from a DC voltage. For generating a sinusoidal line AC voltage from a DC voltage, the DC voltage is converted into a square-wave voltage having voltage pulses whose durations are controlled in accordance with the variation of the sinusoidal line AC voltage to be generated. The square-wave voltage is transmitted via a high-frequency transformer. Subsequently, the transmitted voltage pulses are respectively tapped and filtered for a given chronological duration. A secondary side of the high-frequency transformer is respectively shorted during pulse pauses caused by the sinusoidal control of voltage pulse durations for a simultaneous constant applied pulse frequency. In these phases, energy is transmitted back to the source of the DC voltage via the high-frequency transformer. As a result, the circuit arrangement can also be employed as a charging circuit.

Abstract: A circuit board assembly for data equipment such as those having large numbers of layers and great power requirements in a small space having high computer performance, includes a multi-layer printed circuit board in laminated technology provided with voltage supply and signal carrying layers and pressure contacts at both sides connecting the multi-layer printed circuit board to further printed circuit boards. The further printed circuit boards, which are formed using micro-wiring technology, include backsides which are free of electrical components and connected to the pressure contacts and opposite sides carrying integrated electrical elements such as circuit chips forming an electrical circuit. Cooling plates are pressed against the surfaces of the circuit chips.