Abstract: A thin flexible steel mask is provided for use in vacuum depositing high resolution back metal electrodes on the surface of a glass substrate already having deposited thereon front transparent electrodes and a thin-film structure including an electroluminescent layer sandwiched between layers of a dielectric.The spaced filaments provided on the mask for defining the openings through which the metal electrodes are deposited are joined together along the lengths thereof by reinforcing portions which provide for rigidly holding the filaments in the plane of the mask and enable a permanent magnet to retain the filaments of the mask in position flush against the surface of the substrate. After the metal has been deposited a first time through the openings in the mask, the mask is repositioned on the substrate such that the reinforcing portions now lie over the areas already deposited on and uncover the portions of the substrate that have yet to be deposited on.

Abstract: A mounting unit for a thin-film EL panel includes a substrate provided with cross-grid electrodes on the back surface thereof having aligned terminals located along the marginal sides thereof and a printed circuit board provided with a plurality of conductive paths on the front surface thereof having aligned end portions located along the side portions thereof. The printed circuit board is provided with plated-through connecting holes and routing holes. Some of the conductive paths on the front surface of the printed circuit board are connected to some of the connecting holes and others of the conductive paths are connected to the routing holes. The back surface of the printed circuit board is provided with conductive paths connecting the routing holes to others of the connecting holes. Plug connectors for electrical circuit means are positioned on the back of the printed circuit board with their leads respectively connected to the connecting holes.