Abstract: Provided is a wafer-level package with metal shielding structure and the manufacturing method for producing the same. The wafer-level package includes first conductive structures for securing a die unit to a substrate, and is featured by disposing one or more second conductive structures that are located at the front surface of the die unit and proximate to a side surface of the die unit. The second conductive structure does not electrically connected to the internal circuitry of the die unit. After the wafer is cut, a metal shielding layer is formed on the back surface and the side surfaces of the die unit. Afterwards, the die unit is mounted on the substrate to allow the second conductive structure to connect to the ground structure on the substrate and connect to the metal shielding layer. Thus, EMI shielding function is generated to efficiently suppress EMI and miniaturize the package.

Abstract: The present invention provides an optical package module, which comprises a substrate, a light emitting element, a first molding compound, a second molding compound, a light sensing element, and a cap. The light emitting element and the light sensing element are disposed on the substrate, and the first molding compound and the second molding compound are respectively molded upon the light sensing element and the light emitting element. The first molding compound comprises a first optical structure corresponding to the light sensing element, and the second molding compound comprises a second optical structure corresponding to the light emitting element. By designing the first and second optical structure of the optical package module, it achieves the purposes of improving light emitting and sensing efficiency of the present invention.

Abstract: The present invention discloses a compact sensor package structure, which comprises a package body, an LED chip and a sensor chip. The package body has a first room, a second room, a first hole and a second hole. The first and second rooms are independent to each other. The first and second holes interconnect the interiors and the external environments of the first and second rooms. The LED chip is arranged inside the first room, corresponding to the first hole and below the first hole. The LED chip projects light through the first hole. The sensor chip is arranged inside the second room, corresponding to the second hole and above/below the second hole. The sensor chip receives light via the second hole. The present invention features two independent rooms for two chips and prevents interference between the two chips.

Abstract: The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

Abstract: The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliability between pads and metallic traces when protection layer lay on the forming frame. It improves drawbacks of the glue pass trough the gap between optical sensor chip and pads into the optical sensor area of optical sensor chip. It improves the high process yield and reduces the height of optical sensor chip package to achieve lightly and thinly.

Abstract: The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is installed to the substrate with a glue material in order to envelop the light-sensing chip. Thereby, the present invention not only can clean pollutants completely and promote the yield, but also can reduce the packaging area. In the present invention, the engagement portions may also be formed on the substrate and the light transparent cover so that the alignment can be undertaken easily.

Abstract: The present invention discloses a packaging structure of a light-sensing device with a spacer wall, wherein a spacer wall is used to protect the light-sensing region from external pollutants or two spacer walls are used to confine the glue to therebetween lest the overflow glue pollute the light-sensing region as in the conventional technology. Further, the present invention can reduce the packaging area and can promote the yield and quality obviously.

Abstract: An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.

Abstract: In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate instead of being located at the periphery of the substrate. Contamination can thus be avoided during the glue dispensing process, and protection layers can also be used to seal gaps generated by the plated through vias, hence enhancing the producing yield. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality.