Patents Assigned to Sikama International, Inc.
  • Solder reflow processor
    Patent number: 5524810
    Abstract: A tunnel-type processor for solder flow application of solder connections to circuit elements on a circuit board. The boards with deposited solder are passed through a heating zone and a cooling zone, on a platen. Heated or cooled gas is injected into the zones to maintain a suitable temperature along with the platen. A housing with an exhaust conduit encloses the platen and limits flow of gas from one zone into another. An optional top manifold can be provided to discharge gas into a respective zone.
    Type: Grant
    Filed: April 14, 1994
    Date of Patent: June 11, 1996
    Assignee: Sikama International, Inc.
    Inventor: Kail S. Wathne