Abstract: A photovoltaic device and related methods of manufacture. The device has a support substrate having a support surface region. The device has a thickness of crystalline material characterized by a plurality of worm hole structures therein overlying the support surface region of the support substrate. The worm hole structures are characterized by a density distribution. The one or more worm hole structures have respective surface regions. In a specific embodiment, the thickness of crystalline material has an upper surface region. The device has a passivation material overlying the surface regions to cause a reduction of a electron-hole recombination process. A glue layer is provided between the support surface region and the thickness of crystalline material. A textured surface region formed overlying from the upper surface region of the thickness of crystalline material.

Abstract: A composite structure, e.g., rigid or flexible. The structure has a layer transferred photovoltaic material (e.g., single crystal silicon) having a first region and a second region, and a thickness of material provided between the first region and the second region. The structure has a glue layer overlying the second region. A permeable membrane structure is overlying the glue layer, the permeable membrane structure configured to facilitate outgassing of any volatile species in the glue layer to allow the glue layer to bind the permeable membrane to the layer transferred photovoltaic material.

Abstract: Method and structure for hydrogenation of silicon substrates with shaped covers. According to an embodiment, the present invention provides a method for fabricating a photovoltaic material. The method includes providing a semiconductor substrate. The method also includes forming a crystalline material characterized by a plurality of worm hole structures therein overlying the semiconductor substrate. The worm hole structures are characterized by a density distribution from a surface region of the crystalline material to a defined depth within a z-direction of the surface region to form a thickness of material to be detached. The method further includes providing a glue layer overlying a surface region of the crystalline material. The method includes joining the surface region of the crystalline material via the glue layer to a support substrate.

Abstract: A method for forming solar cells includes providing a crystalline silicon substrate which can be mono-, multi-, or poly-crystalline, the substrate being defined by a first thickness, the substrate including a first surface and a second surface, the first surface on an opposite side of the second surface. The method also includes forming a separation region within the first thickness, the separation region including hydrogen species, the separating region being substantially parallel to the first surface, the separation region defining a first portion and a second portion within the thickness. Additionally, the method includes providing a mould structure defining a support region on the first surface in which a layer of ceramic material is formed, followed by mould removal. Additionally, the method includes forming electrical devices on the first portion and packaging formed solar cells, including interconnections for solar tile applications.

Abstract: A thin photovoltaic device for solar cell applications. As used herein, the term “thin” generally means less than about 20 microns of silicon crystal material, but can also be other dimensions. The term thin should not be limited and should be construed broadly and consistently as one of ordinary skill in the art. In a specific embodiment, the device has a support substrate having a surface region. The device has a thickness of photovoltaic material overlying the surface region of support substrate and having a predefined surface texture to facilitate trapping of one or more incident photons using at least a refraction process to cause the one or more photons to traverse a longer optical path within an inner region of the thickness of material according to a specific embodiment. In a specific embodiment the longer optical path is provided relative to a shorter optical path characteristic of a surface region without the predefined surface roughness.

Abstract: A composite structure, e.g., rigid or flexible. The structure has a layer transferred photovoltaic material (e.g., single crystal silicon) having a first region and a second region, and a thickness of material provided between the first region and the second region. The structure has a glue layer overlying the second region. A permeable membrane structure is overlying the glue layer, the permeable membrane structure configured to facilitate outgassing of any volatile species in the glue layer to allow the glue layer to bind the permeable membrane to the layer transferred photovoltaic material.

Abstract: Method and structure for hydrogenation of silicon substrates with shaped covers. According to an embodiment, the present invention provides a method for fabricating a photovoltaic material. The method includes providing a semiconductor substrate. The method also includes forming a crystalline material characterized by a plurality of worm hole structures therein overlying the semiconductor substrate. The worm hole structures are characterized by a density distribution from a surface region of the crystalline material to a defined depth within a z-direction of the surface region to form a thickness of material to be detached. The method further includes providing a glue layer overlying a surface region of the crystalline material. The method includes joining the surface region of the crystalline material via the glue layer to a support substrate.

Abstract: A photovoltaic device and related methods of manufacture. The device has a support substrate having a support surface region. The device has a thickness of crystalline material overlying the support surface region of the support substrate. Preferably, the thickness of material has an upper surface region. The device has a glue layer provided between the support surface region and the thickness of material according to a specific embodiment. In a preferred embodiment, the device has a textured surface region formed overlying from the upper surface region of the thickness of crystalline material. Depending upon the embodiment, the device has a plurality of elevated regions having a first thickness defining a first portion of the textured surface region and a plurality of recessed regions having a second thickness defining a second portion of the textured surface region.

Abstract: System and method for forming solar cell structures using a foundry compatible process. According to an embodiment, the present invention provides a method for manufacturing a solar cell. The method includes providing a substrate. The substrate includes a support region. The method also includes transferring a photovoltaic material overlying the support region of the substrate. The photovoltaic material is characterized by a first thickness. The method further includes forming an emitter region on the photovoltaic material by a diffusion process. The emitter region is characterized by a first impurity type. In addition, the method includes forming a mask overlaying the emitter region. The mask exposes at least a first contact region. The method also includes forming the first contact region within the first thickness of the photovoltaic material. Furthermore, the method includes doping the first contact region with a second impurity type.