Patents Assigned to Silicon Labs SC, Inc.
  • Patent number: 7858422
    Abstract: A MEMS coupler and a method to form a MEMS structure having such a coupler are described. In an embodiment, a MEMS structure comprises a member and a substrate. A coupler extends through a portion of the member and connects the member with the substrate. The member is comprised of a first material and the coupler is comprised of a second material. In one embodiment, the first and second materials are substantially the same. In one embodiment, the second material is conductive and is different than the first material. In another embodiment, a method for fabricating a MEMS structure comprises first forming a member above a substrate. A coupler comprised of a conductive material is then formed to connect the member with the substrate.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: December 28, 2010
    Assignee: Silicon Labs SC, Inc.
    Inventors: Emmanuel P. Quevy, Roger T. Howe
  • Patent number: 7830216
    Abstract: A frequency-control circuit, which is configured to receive a first signal having a first untuned frequency from a first oscillator, and to alter one or more pulses of the first signal to tune an output frequency of an output clock signal to have an average frequency at the desired target frequency. In some embodiments, the frequency-control circuit receives a signal from a single oscillator to generate a calibrated, precise, and temperature-stable clock.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: November 9, 2010
    Assignee: Silicon Labs SC, Inc.
    Inventors: Manu Seth, David Brubaker, Andrew McCraith, Richard Steven Miller, Mir Bahram Ghaderi
  • Patent number: 7816166
    Abstract: A method to form a MEMS structure is described. In an embodiment, a structure having a first release layer between a substrate and a member is provided. A second release layer is adjacent to a sidewall of the member. At least a portion of each of the first and the second release layers is then removed. In one embodiment, the member is formed by a damascene process. In another embodiment, the member is formed by a subtractive process. In a specific embodiment, the second release layer formed adjacent to a sidewall of the member has sub-lithographic dimensions.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: October 19, 2010
    Assignee: Silicon Labs SC, Inc.
    Inventor: Emmanuel P. Quevy
  • Patent number: 7764131
    Abstract: A frequency-control circuit, which is configured to receive a first signal having a first untuned frequency from a first oscillator, and to alter one or more pulses of the first signal to tune an output frequency of an output clock signal to have an average frequency at the desired target frequency. In some embodiments, the two oscillators of intentionally different frequencies are periodically switched at a duty factor, which is dependent on an absolute temperature, to generate a calibrated, precise, and temperature-stable clock.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: July 27, 2010
    Assignee: Silicon Labs SC, Inc.
    Inventors: Manu Seth, David Brubaker, Andrew McCraith, Richard Steven Miller, Mir Bahram Ghaderi