Abstract: A device module may be used to carry a plurality of devices, such as memory devices or other components. The device module may include a board, a first set of contact points, and a second set of contact points. A plurality of signal paths may be provided on the board, where each signal path extends between a contact point in the first set and a contact point in the second set. Each of the plurality of signal paths has substantially an identical length and a same number of turns on the board.

Abstract: A connector is described which uses a coupling structure integrally formed from a plurality of discrete elements that are aligned to receive an insertion force. In response to the insertion force affecting some or all of the elements, the affected elements move from an original state into a deflected state. In the deflected state, the overall thickness of the coupling structure is reduced. The relationship between the coupling structure and a dimension of a cavity that is to be occupied by the coupling structure is such that when the thickness of the coupling structure is reduced, the dimension of the cavity is increased.

Abstract: A memory system having a memory controller, interface device and plurality of memory elements. The interface device is coupled to the memory controller via a first high-speed signal path. The plurality of memory elements are removably coupled to the interface device via respective second signal paths, each of the second signal paths having a lower signaling bandwidth than the first signaling path.