Patents Assigned to Smart Pac GmbH Technology Services
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Patent number: 8328068Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.Type: GrantFiled: April 17, 2008Date of Patent: December 11, 2012Assignees: Pac Tech—Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventors: Ghassem Azdasht, Siavash Tabrizi
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Patent number: 7926699Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum imType: GrantFiled: September 24, 2009Date of Patent: April 19, 2011Assignees: Pac Tech—Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventors: Elke Zakel, Ghassem Azdasht
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Publication number: 20100213243Abstract: The present invention relates to a transfer device (10) for receiving and transferring a solder ball arrangement (28). Said transfer device comprises a discharge container (11) and a transfer substrate (12) that interacts with the discharge container in order to obtain a flat solder ball arrangement and that can be subjected to a negative pressure. The discharge container comprises an at least partially perforated base wall (14) and the transfer substrate has a hole pattern for receiving the solder ball arrangement. The discharge container comprises an ultrasound device (37) for subjecting said discharge container to ultrasound vibrations.Type: ApplicationFiled: April 17, 2008Publication date: August 26, 2010Applicants: Pac Tech- Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventors: Ghassem Azdasht, Siavash Tabrizi
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Patent number: 7762446Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum imType: GrantFiled: September 26, 2005Date of Patent: July 27, 2010Assignees: Pac Tech—Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventors: Elke Zakel, Ghassem Azdasht
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Patent number: 7726543Abstract: A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece of solder material is at least partially melted off. The at least partially melted off formed piece of solder material being thrust against a bonding arrangement in such a way that both bonding partners are wetted in a bonding area to establish an electrically conductive bonding.Type: GrantFiled: February 25, 2008Date of Patent: June 1, 2010Assignee: Smart Pac GmbH Technology ServicesInventor: Ghassem Azdasht
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Publication number: 20080302863Abstract: Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum imType: ApplicationFiled: September 26, 2005Publication date: December 11, 2008Applicant: PAC TECH - PACKAGING TECHNOLOGIES GMBH AND SMART PAC GMBH TECHNOLOGY SERVICESInventors: Elke Zakel, Ghassem Azdasht
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Patent number: 7360679Abstract: A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece of solder material is at least partially melted off. The at least partially melted off formed piece of solder material being thrust against a bonding arrangement in such a way that both bonding partners are wetted in a bonding area to establish an electrically conductive bonding.Type: GrantFiled: September 10, 2002Date of Patent: April 22, 2008Assignee: Smart Pac GmbH Technology ServicesInventor: Ghassem Azdasht
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Patent number: 7106599Abstract: The invention pertains to a chip module 20 and a method for producing a chip card module that comprises a chip module with a chip carrier 21 and a chip 22 that is contacted with strip conductors 25, 26 of the chip carrier, wherein the chip carrier comprises a flexible carrier material and the strip conductors respectively extend over the length of the carrier substrate, and wherein the chip carrier 21 contains two longitudinal regions 35, 36 of identical length which are offset relative to one another in the longitudinal direction of the chip carrier and respectively assigned to one strip conductor 25, 26.Type: GrantFiled: November 14, 2001Date of Patent: September 12, 2006Assignee: Smart Pac GmbH Technology ServicesInventor: Ghassem Azdasht
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Patent number: 7049213Abstract: The invention relates to a method for producing a contact substrate (10) as well as to a contact substrate with through-plating between a connector arrangement (21) arranged at the top of a dielectric carrier substrate (12) and the underside of the carrier substrate, wherein the connector arrangement extends along an aperture margin (22) of a substrate recess (15), and the underside (11) of the carrier substrate (12) is supported by a backstop (23), wherein a formed solder material part (24) is placed in the substrate recess (15), and in a subsequent method-related step said formed solder material part (24) is deformed within the substrate recess so as to form a formed contact part (50), such that radial displacement of the material of the formed solder material part in the substrate recess results in a non-positive connection between an intrados surface (28) of the substrate recess and the connector arrangement (21), and that the formed contact part provides through-plating between the connector arrangementType: GrantFiled: May 22, 2002Date of Patent: May 23, 2006Assignees: Pac Tech-Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventors: Elke Zakel, Ghassem Azdasht
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Patent number: 6713714Abstract: A method and a device for thermally connecting the terminal areas (26, 27) of a contact substrate (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connection, arranged in a connecting position such that the terminal areas (26, 28; 27, 29) are situated opposite one another in the plane of the connection, where the contact substrate (11) is heated to the connecting temperature from its rear side that is situated opposite the terminal areas (26, 27) in order to reach the required connecting temperature in the plane of the connection, and where the contact substrate (11) is heated by subjecting the substrate to laser energy.Type: GrantFiled: July 17, 2001Date of Patent: March 30, 2004Assignees: Pac Tech-Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventor: Ghassem Azdasht
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Patent number: 6651891Abstract: The present invention relates to a method of producing a contactless chip card. In a first step of the method, a card body with one or a plurality of recesses on one card body side is produced from a theremoplastic material, preferably by injection moulding. Bumps being formed on the base surface of the recesses. Subsequently, conductor tracks corresponding to a coil as a conductor track pattern are impressed directly onto surface areas of the card body side including the recesses using a hot impressing technique. The conductor tracks are impressed especially also onto surface areas inside the recesses such that same extends across the bumps. One or a plurality of chips are then aligned in the recesses and contacted with the conductor tracks in the recesses which extend across the bumps. The method according to the present invention is advantageous insofar as it permits a simple production of a chip card, which requires only a few method steps and is therefore also economical.Type: GrantFiled: June 28, 2000Date of Patent: November 25, 2003Assignees: Smart Pac GmbH - Technology ServicesInventors: Elke Zakel, Rolf Aschenbrenner, Frank Ansorge, Paul Kasulke
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Patent number: 6642727Abstract: A chip carrier arrangement (10) for an encased chip arrangement has a chip carrier (11), whose one chip contact side (24) exhibits a conductor path structure (12) with a terminal face (17) extending to an outer contact side (25) of the chip carrier and allocated to at least one chip (18) with a through connection (14). The chip carrier (11) has additional through connections (14) connected with the conductor path structure (12), which are used for contacting with test connections (32) of a test board (29, 30).Type: GrantFiled: April 2, 2001Date of Patent: November 4, 2003Assignees: Pac Tech-Packaging Technologies GmbH, Smart Pac GmbH Technology ServicesInventors: Hartmut Rohde, Gerhild Wendland
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Patent number: 6407457Abstract: An electronic contacting method for contacting a chip having a plurality of conductive contact areas, which are not provided with an additional metallization layer, a carrier substrate is provided, which has a first surface having arranged thereon a plurality of conductive connecting sections. A non-conductive adhesive layer is arranged on the first surface of the carrier substrate and subsequently, the carrier substrate is aligned with a chip to be contacted in such away that a plurality of conductive contact areas on said chip to be contacted is in alignment with the connecting sections on the first surface of said carrier substrate. Then the carrier substrate is connected to the chip to be contacted by means of the adhesive layer in such a way that the connecting sections of the carrier substrate and the contact areas of the chip abut on one another by means of pressure contact, without any intermetallic connection being established.Type: GrantFiled: November 1, 2000Date of Patent: June 18, 2002Assignee: Smart Pac GmbH - Technology ServicesInventors: Rolf Aschenbrenner, Elke Zakel, Hans-Hermann Oppermann, Ghassem Azdasht
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Patent number: 6180434Abstract: A method of producing a contactless chip card (10) includes first the step of holding a chip (14), which is provided with terminal pads (16a, 16b) on a surface thereof, in a mould defining a chip-card substrate (12), in such a way that the chip surface provided with the terminal pads is located substantially in the same plane as a chip-card substrate surface defined by the mould. In addition, a chip-card substrate material is introduced into the mould, whereupon a coil structure (18) is applied by screen-printing a conductive paste onto the chip-card substrate (12) in such a way that the coil structure (18) extends up to the terminal pads (16a, 16b) on the chip.Type: GrantFiled: April 13, 1999Date of Patent: January 30, 2001Assignees: Smart Pac GmbH Technology ServicesInventors: Martin Lange, Ghassem Azdasht