Patents Assigned to Smart Packaging Soultions (SPS)
  • Patent number: 8100337
    Abstract: The invention concerns an electronic module (11) with double communication interface, in particular for a chip card, the said module comprising firstly a substrate (27) provided with an electrical contact terminal block (17) allowing functioning by contact with the contacts of a reader, and secondly comprising an antenna comprising at least one turn (13) and whose terminals are connected to the terminals of a microelectronic chip situated on one face of the module (11). This module (11) is characterised in that the antenna turns (13) are situated substantially outside the area covered by the electrical contacts (17), so that the electrical contacts of the terminal block do not constitute electromagnetic shielding for the signals intended for the antenna. The invention applies in particular to the production of chip cards with double communication interface with contact and without contact.
    Type: Grant
    Filed: August 28, 2006
    Date of Patent: January 24, 2012
    Assignee: Smart Packaging Soultions (SPS)
    Inventors: Olivier Artigue, Henri Boccia, Olivier Brunet