Patents Assigned to Smartrac IP B.V.
  • Patent number: 8028923
    Abstract: An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: October 4, 2011
    Assignee: Smartrac IP B.V.
    Inventors: Guy Shafran, Oded Bashan
  • Patent number: 7878561
    Abstract: A seal device (20) with a seal body (21) and an attachment device (22) for the captive attachment of the seal body to an object to be sealed, wherein one end of the attachment device is connected in a single piece with the seal body while its other end comprises a joining device (26) for non-positive joining to a connection device (27) that is provided on the seal body, wherein the seal body comprises a data carrier that comprises a data transmission device (32), which data carrier is designed as a switching circuit (23), wherein the switching circuit comprises an external circuit bridge (25) which for the purpose of connecting two connection points (29) of the switching circuit leads through the attachment device.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: February 1, 2011
    Assignee: Smartrac IP B.V.
    Inventor: Manfred Rietzler
  • Publication number: 20100226107
    Abstract: The invention relates to a method and a semifinished product for producing an inlay, in particular for chip cards, stored value cards, identification documents, or the like, having at least two electronic components, all electronic components being arranged in a relative configuration on a carrier substrate to implement a component configuration and the component configuration being arranged in a filler material. Furthermore, the invention relates to a method for producing a card having a semifinished product and a card produced using the semifinished product.
    Type: Application
    Filed: November 23, 2007
    Publication date: September 9, 2010
    Applicant: SMARTRAC IP B.V.
    Inventor: Manfred Rietzler
  • Publication number: 20100097280
    Abstract: The present disclosure pertains to a transponder device (10) having an antenna arrangement and a chip (13) disposed on an antenna substrate (11), wherein the antenna arrangement comprises at least a first antenna unit formed as a loop antenna (16) that is connected electrically conductively to contact surfaces (14, 15) of the chip via conductor ends of an antenna conductor (17) that is used for the formation of the loop antenna, and wherein the antenna arrangement besides the first antenna unit comprises at least one further antenna unit formed as a dipole antenna (19).
    Type: Application
    Filed: October 20, 2008
    Publication date: April 22, 2010
    Applicant: Smartrac IP B.V.
    Inventors: Glen Zirbes, Scott Stole, Martin Kuschewski
  • Publication number: 20100083485
    Abstract: A method for producing a security layered construction as well as a security layered construction for an identification document (61), particularly for personal identification, having a transponder layer (20) and at least one cover layer (38, 39), the transponder layer being covered using the at least one cover layer to form a seal with the wire conductor positioned interposed, and at least one viewing side (62) of the at least one cover layer or transponder layer being provided with security printing (63).
    Type: Application
    Filed: October 5, 2009
    Publication date: April 8, 2010
    Applicant: Smartrac IP B.V.
    Inventor: Manfred Rietzler
  • Publication number: 20100060458
    Abstract: The present disclosure generally pertains to a transponder device (10) comprising a transponder unit (37), which is arranged in a housing (13) and has an antenna device (38) and a chip (39), the housing forming a receiving space between a transparent front wall (15) and a housing rear wall (16) having arranged therein an optically readable information carrier (34), the housing rear wall having a fastening edge (22) defining a fastening plane (21) of the housing.
    Type: Application
    Filed: September 10, 2008
    Publication date: March 11, 2010
    Applicant: Smartrac IP B.V.
    Inventors: Scott Stole, Brian Bender, Glen Zirbes, Tom Holsapple
  • Publication number: 20100001078
    Abstract: The invention relates to a transponder unit (10), in particular for transponder cards, identification documents or suchlike, having at least one chip (15) and at least one antenna (11), wherein the antenna is formed from a metal conductor which is arranged on an antenna substrate (14) and is permanently connected to the latter, and wherein said conductor is provided with a structure device which is integrally connected to the conductor and is intended to form a composite conductor (12) such that the composite conductor has a higher tensile stress or a higher elongation break than the conductor.
    Type: Application
    Filed: October 25, 2007
    Publication date: January 7, 2010
    Applicant: Smartrac IP B.V.
    Inventors: Manfred Rietzler, Wolfgang Schneider
  • Patent number: 7612677
    Abstract: A method for producing a security layered construction as well as a security layered construction for an identification document (61), particularly for personal identification, having a transponder layer (20) and at least one cover layer (38, 39), the transponder layer being covered using the at least one cover layer to form a seal with the wire conductor positioned interposed, and at least one viewing side (62) of the at least one cover layer or transponder layer being provided with security printing (63.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: November 3, 2009
    Assignee: Smartrac IP B.V.
    Inventor: Manfred Rietzler
  • Publication number: 20080314990
    Abstract: The invention pertains to a chip card and to a method for producing a chip card with a chip module that is contacted with an external contact arrangement arranged in the contact surface of a card body, as well as with an antenna device arranged in a card inlay, wherein the card inlay is initially produced in a first production device and the card inlay is subsequently provided with at least one respective external layer on both sides in a second production device, namely in such a way that the external contact arrangement arranged on the external contact side of the chip carrier is introduced into a recess of the assigned external layer, and wherein a connection between the card inlay and the external layers is subsequently produced in a laminating process.
    Type: Application
    Filed: November 30, 2006
    Publication date: December 25, 2008
    Applicant: SMARTRAC IP B.V.
    Inventor: Manfred Rietzler