Patents Assigned to SOFTPV INC.
  • Patent number: 11901468
    Abstract: The present disclosure relates to a semiconductor packaging capable of supplying power by itself by including, as a power supply part, photovoltaic particles having a core-shell structure, wherein the photovoltaic particles in a semiconductor package generate voltage and current required for semiconductors so that the semiconductor package can be easily driven only with the power generated by itself, it is possible to overcome the restrictions on miniaturization of semiconductor packages due to connection with external power sources, and the photovoltaic particles are located between a semiconductor chip and a substrate so that the semiconductor package is easy to miniaturize.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: February 13, 2024
    Assignee: SOFTPV INC.
    Inventors: Sunggue Lee, Hyeonwoo Ahn