Abstract: A desoldering wick which comprises a small number (e.g., three) of strands of a thin wire (i.e., having a diameter less than about 0.002") braided together to form a hollow tube which is subsequently flattened. Such a wick is suitable for use in desoldering operations for which the heretofore available products were too large, and provides a more rapid removal of molten solder than is achieved with the prior art products. Methods and apparatus are also provided which enable the manufacture of desoldering wicks comprising fewer strands of wire and/or wire of a substantially smaller diameter than has heretofore been possible. By modification of conventional apparatus to reduce the substantial drag on the wire strands heretofore encountered during the braiding operation, it is now possible to prepare wicks with thicknesses on the order of about 0.008" from wire having a substantially smaller diameter (i.e., less than 0.002") than was previously feasible.

Abstract: An effective, convenient, economical and safe system for installing and removing multi-sided gull-wing semiconductor devices from circuit boards without damaging the semiconductor device is provided. The solder removal system is formed by the combination of a surmo-multi-sided wick formed from welded braids and a solder removal gun that has been adapted with a corresponding multi-sided tip face with vacuum capability. An apparatus and process of using such apparatus thereof to produce the multi-sided shape surmo-wick used in the solder removal system are also provided.