Patents Assigned to Soltec B.V.
  • Patent number: 5379931
    Abstract: The invention relates to a soldering device comprising: a vessel opened at the top for filling with solder; at least two solder towers placed in the vessel, each adapted for delivering a flow of solder on their upper side; and a transporting member for carrying along the objects for soldering above the solder towers. In order to prevent, both in the case of soldering machines which operate in a normal atmosphere and those operating in an inert atmosphere, the solder flows falling back into the vessel from splashing solder up onto the underside of the printed circuit boards, the solder towers are adapted for generating jets directed toward each other, wherein the jets intersect before they make contact with the solder level prevalent in the vessel. According to a preferred embodiment the rear tower in the direction of movement forms a jet of solder comprising a movement component counter to the movement of the objects for soldering and enclosing an acute angle with the object for soldering.
    Type: Grant
    Filed: August 26, 1993
    Date of Patent: January 10, 1995
    Assignee: Soltec B.V.
    Inventor: Michiel J. Van Schaik
  • Patent number: 5294036
    Abstract: The invention relates to a wave soldering device in which solder is pumped up from a solder bath and through a tower and issues therefrom in the form of a wave which engages the underside of a circuit board, flows over a front and/or rear weir of the tower and returns to the solder bath. A conveyor transports circuit boards across the top of the tower and the solder wave. A confining structure is situated adjacent the wave and protrudes into the solder bath. A gas which substantially excludes oxygen is injected from a nozzle and follows a circuitous route bordered by solder in the bath, solder flowing over the rear weir, and walls of the confining structure. The gas exiting from an outflow opening of the confining structure is directed across the solder flowing over the rear weir and onto the downstream line of contact of the solder wave and the board as it leaves the solder wave.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: March 15, 1994
    Assignee: Soltec B.V.
    Inventor: Rolf A. Den Dopper
  • Patent number: 5031818
    Abstract: The present invention relates to a soldering machine, comprising: a soldering chamber wherein the soldering process is performed; a first lock chamber connecting to the soldering chamber; a second lock chamber connecting to the soldering chamber; two openings each arranged between a lock chamber and the soldering chamber; two openings each connecting a lock chamber to the outside wherein each opening is closable by a door; means for creating a vacuum in the lock chambers; means for transporting objects for soldering from the outside through the first lock chamber, the soldering chamber and the second lock chamber.
    Type: Grant
    Filed: June 21, 1990
    Date of Patent: July 16, 1991
    Assignee: Soltec B.V.
    Inventor: Koen A. Gieskes
  • Patent number: 5029696
    Abstract: A device for guiding objects such as printed circuit boards has a cooperating pair of spaced apart endless chain conveyors with leaf-like spring members connected to the links of each conveyor by holders such that free ends of leaf-like spring members of opposed conveyors are adapted to engage opposite edges of the object in order to grip the object for transporting by the conveyors. The end of each leaf-like spring member which is attached to a conveyor is provided with a reaction arm portion, angularly disposed relative to the free end thereof at a transition portion, and each holder has a recessed portion into which a reaction arm is form fitted and engaged by a retaining member so that the leaf-like spring member is tiltable about a front edge of the recessed portion of the holder generally at the transition portion of the leaf-like spring member.
    Type: Grant
    Filed: April 18, 1990
    Date of Patent: July 9, 1991
    Assignee: Soltec B.V.
    Inventor: Hermanus B. R. Van Tilburg
  • Patent number: 4848640
    Abstract: An apparatus for the application of a conductive adhesive medium in a fluid state to a side of a printed circuit board bearing electronic components is disclosed. The apparatus generally comprises a hollow shaft standing in a supply tank for the adhesive medium in an obliquely rising conveyor belt for at least one circuit board at a time. The upper end of the hollow shaft has two overflow edges arranged perpendicularly to the direction of transport for the formation of a wave, through the crest of which the side of the card previously moistened with a flux, is passed.
    Type: Grant
    Filed: February 12, 1988
    Date of Patent: July 18, 1989
    Assignee: Soltec, B.V.
    Inventor: Koenraad A. Gieskes
  • Patent number: 4464960
    Abstract: Lead cutting machine for cutting the leads of components mounted on printed circuit boards, this machine including a conveyor mechanism for the boards and a rotating cutting knife fixed on a carriage which is slidably mounted in a horizontal plane and under the path of the boards and which is coupled with the piston of a pneumatically controlled pressurized air cylinder.
    Type: Grant
    Filed: December 31, 1981
    Date of Patent: August 14, 1984
    Assignee: Soltec B.V.
    Inventors: Harry F. Roepers, Herman B. Van Tilburg