Abstract: Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi2O3-based glass frit powder having an average particle diameter of 200 ?m or less. The bonding material may be formed in a paste form by adding a solvent thereto. This feature makes it possible to bond together substrates having different thermal expansion coefficients without causing a crack or unsticking.

Abstract: Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi2O3-based glass frit powder having an average particle diameter of 200 ?m or less. The bonding material may be formed in a paste form by adding a solvent thereto. This feature makes it possible to bond together substrates having different thermal expansion coefficients without causing a crack or unsticking.

Abstract: A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)?(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects.