Abstract: A wave solder nozzle is capable of delivering solder material to perform a wave soldering operation on a printed circuit board in an inert atmosphere. The wave solder nozzle includes a front plate and a back plate coupled to the front plate. The front plate and the back plate define a channel through which solder material flows. The nozzle further includes an exit trough extending from the back plate. The exit trough has a weir provided at one end of the exit trough. The exit trough is constructed and arranged to control the flow of solder material from the wave solder nozzle. A surface of the exit trough is wettable to improve the flow of solder material out of the wave solder nozzle. A method of improving the flow of solder material through the nozzle is also disclosed.

Abstract: A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has bee

Abstract: A vacuum plenum module of a stencil wiper assembly for wiping and removing excess material from a stencil of a stencil printer includes a wiper blade to wipe the stencil, a plenum chamber in fluid communication with the wiper blade, and a vacuum generator attached to and in fluid communication with the plenum chamber to create a vacuum within the plenum chamber. The vacuum plenum module further includes a fluid supply to introduce pressurized fluid into the vacuum generator, and an exhaust to exhaust fluid from the vacuum generator. The vacuum generator includes at least one vacuum ejector adapted to create the vacuum. The vacuum plenum module is further configured to move between a first position in which the vacuum plenum is spaced away from the stencil and a second position in which the vacuum plenum engages the stencil. A method of cleaning a stencil is further disclosed.

Abstract: An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface includes a frame, a transportation system that moves the substrate through the apparatus, a substrate support system, coupled to the frame, having a non-rigid portion that contacts and supports the substrate during an operation on the substrate, wherein the non-rigid portion allows flexure of the substrate before and during the performance of an operation on the substrate, and a device coupled to the frame that performs an operation on a surface of the substrate.

Abstract: A quick-change material module of a stencil wiper assembly for wiping a stencil of a stencil printer includes a supply roller to receive a roll of material, a take-up roller to receive used material, and a drive to move the material across the stencil between the supply roller and the take-up roller. The supply roller is designed to move between an operating position in which the module functions to wipe the stencil and a changing position in which the supply roller is accessible to change the roll of material. A pivot mechanism is further disclosed for pivoting the supply roller between the operating and changing positions. A frame supports the supply roller, the take-up roller, and the drive. The pivot mechanism includes at least one pivot arm having one end rotatably attached to the supply roller and an opposite end pivotably attached to the frame.

Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.

Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.

Abstract: A stencil printer for printing solder paste onto a substrate includes a frame, a stencil, coupled to the frame, having apertures formed therein, a support assembly, coupled to the frame, to support the substrate in a printing position beneath the stencil, and a dispensing head coupled to the frame in such a manner that the dispensing head is configured to traverse the stencil during first and second print strokes. The dispensing head includes a frame assembly and a wiper blade assembly, coupled to the frame assembly, having first and second wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The first and second wiper blades are constructed and arranged to force solder paste through the apertures of the stencil. The dispensing head further includes a dispensing unit, coupled to the frame assembly, having a chamber adapted to dispense solder paste, the dispensing unit being disposed between the first and second wiper blades to deposit solder paste therebetween.

Abstract: An apparatus and methods for depositing material on a surface of an electronic substrate are provided and include a squeegee device or system for distributing material to be deposited on the electronic substrate. The squeegee device or system can include a first wiping blade and a second wiping blade spaced from and parallel to the first wiping blade. The first wiping blade and the second wiping blade are disposed at an angle relative to a vertical axis, the vertical axis being perpendicular to a surface of an electronic substrate, such that when the first and the second wiping blades contact a surface of a stencil to deposit or print the material onto the electronic substrate, the first and the second wiping blades contact the stencil surface at a rake angle relative to a direction in which the squeegee device traverses the stencil surface.

Abstract: Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.

Abstract: A printer includes a print head for dispensing viscous material, such as solder paste. The print head defines a chamber and includes at least one source port and a dispensing slot. Within the chamber, a flexible membrane segregates the chamber into a dispensing region and an activation region. Viscous material flows from a supply mounted to the source port, into the dispensing region and out the slot. A displacement mechanism is positioned to displace the flexible membrane to reduce the volume of dispensing region and to thereby dispense viscous material through the slot. The print head also includes a removable envelope through which the viscous material flows and contacts as it passes through the envelope.

Abstract: A stencil wiper apparatus for wiping a stencil of a stencil printer includes a material supply assembly having a supply roller to deliver a roll of material, a take-up roller to receive the material, and a drive to move the material across the stencil between the supply roller and the take-up roller. The apparatus further includes a fluid delivery assembly to wet the material. The fluid delivery assembly includes an outer tube, an inner tube and a fluid delivery source. The outer tube is designed to engage the material and to deliver fluid to the material. The inner tube is positioned within the outer tube, and designed to deliver fluid to the outer tube. The fluid delivery source delivers fluid to the inner tube. A method for wiping a stencil of a printing machine is further disclosed.

Abstract: When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing the dross from the reservoir includes a skimming plate pivotally attached to a displaceable structure; a stop is provided to restrict the degree to which the skimming plate can pivot so that the skimming plate will not pivot more than 90° from vertical to enable the skimming plate to dig into the dross and collect dross when the displaceable structure is displaced toward on outlet of the reservoir. Further still, the displaceable structure of the skimmer can be controlled via a computer control system storing software code instructions for a motor to extend and retract the displaceable structure such that the skimming plate extends to a position further from the outlet port of the reservoir with each displacement cycle.

Abstract: An apparatus for performing operations on a surface of an electronic substrate comprises a frame, a dispenser, coupled to the frame, to dispense a material onto the electronic substrate, a stencil moveable on a gantry system having at least one aperture to receive the material as the material is dispensed on the substrate, a controller that controls dispensing of the material on the substrate, and a wiper to remove material from the stencil as the stencil is translated away from the electronic substrate by the gantry system.

Abstract: A vacuum plenum module of a stencil wiper assembly for wiping and removing excess material from a stencil of a stencil printer includes a wiper blade to wipe the stencil, a plenum chamber in fluid communication with the wiper blade, and a vacuum generator attached to and in fluid communication with the plenum chamber to create a vacuum within the plenum chamber. The vacuum plenum module further includes a fluid supply to introduce pressurized fluid into the vacuum generator, and an exhaust to exhaust fluid from the vacuum generator. The vacuum generator includes at least one vacuum ejector adapted to create the vacuum. The vacuum plenum module is further configured to move between a first position in which the vacuum plenum is spaced away from the stencil and a second position in which the vacuum plenum engages the stencil. A method of cleaning a stencil is further disclosed.

Abstract: A needle foot assembly for a dispensing system includes a needle nut, a rotatable bearing, a friction brake, and an end piece holding the needle foot. The needle foot assembly attaches the needle to a dispensing head of the dispensing system. Rotation of the bearing alters the orientation of the needle foot and needle. The needle foot is removeably attached to the end piece and can be adjusted with respect to height.

Abstract: A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.

Abstract: Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled.

Abstract: A rail position control system is provided that controls a conveyor system configuration to accommodate a plurality of differently sized substrates in an apparatus. The rail position control system includes at least one camera, which is mounted on a mounting surface located in close proximity to the conveyor system. The rail position control system further includes a computer system that is operatively coupled to the camera and to a motor. The motor is further coupled to at least one rail of the conveyor system. The camera is operative to view and provide a plurality of images of a conveyor lane width value to the computer system. The conveyor lane width value represents a space located between at least one pair of rails of the conveyor system.

Abstract: A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.