Abstract: Methods and systems for cleaning photoresist dispense nozzles of a wafer processing photoresist coater module are disclosed. A method comprises dispensing a photoresist cleaning solvent from an edge bead removal dispense of the coater module onto a central portion of a substrate disposed on a spin chuck to form a puddle, making contact between the photoresist dispense nozzles and the puddle and washing for a select amount of time, thereby removing photoresist from the photoresist dispense nozzles. A system comprises a process controller controlling positioning of the photoresist dispense nozzles over the substrate, positioning of the edge bead dispense over the central portion of the wafer, dispensing photoresist cleaning solvent on the central portion of the wafer, and positioning of the spin chuck such that the photoresist dispense nozzles contact the solvent for cleaning.

Abstract: A removable air flow control housing having a chamber for holding a substrate which is rotatable with and attachable by vacuum to a spin chuck of a spin coating apparatus. The housing has a lid in a top wall that can be hinged, screwed, magnetically secured or frictionally held in place. The chuck is nestable within a cutout region disposed within a central inner portion of the housing while an outer portion of the housing has a toroidal shape beyond edges of the chuck for reducing air turbulence and capturing excess coating fluid. The cutout region forms a shape that corresponds to the chuck shape. An upper cutout wall has vacuum holes in vertical alignment with vacuum holes of the chuck. The housing is attachable by vacuum to the chuck when the chuck is nested within the cutout region and the substrate is positioned on an upper surface of the upper cutout wall. The housing and substrate are rotatable with the chuck about a chuck axis of rotation as a coating solution is dispensed onto the substrate.

Abstract: A removable air flow control housing having a chamber for holding a substrate which is rotatable with and attachable by vacuum to a spin chuck of a spin coating apparatus. The housing has a lid in a top wall that can be hinged, screwed, magnetically secured or frictionally held in place. The chuck is nestable within a cutout region disposed within a central inner portion of the housing while an outer portion of the housing has a toroidal shape beyond edges of the chuck for reducing air turbulence and capturing excess coating fluid. The cutout region forms a shape that corresponds to the chuck shape. An upper cutout wall has vacuum holes in vertical alignment with vacuum holes of the chuck. The housing is attachable by vacuum to the chuck when the chuck is nested within the cutout region and the substrate is positioned on an upper surface of the upper cutout wall. The housing and substrate are rotatable with the chuck about a chuck axis of rotation as a coating solution is dispensed onto the substrate.

Abstract: An apparatus for centering workpieces of different sizes, particularly wafers, featuring a single plane centering guide. The guide features a plate having a cutout region with a first arcuate cutout within which a portion of a circumference of a first circular workpiece is nestable and a second arcuate cutout adjacent to and deeper than the first arcuate cutout and centered along the cutout region within which a portion of a circumference of a smaller second circular workpiece is nestable. The arcuate cutouts and nested workpiece have centers of curvature along a common centerline that are collinear with a linear path. The workpiece delivery device horizontally moveable along the linear path, delivers a workpiece to the nesting position thereby centering the workpiece relative to the first or second arcuate cutout. From the centered position, the workpiece delivery device may deliver the workpiece to a predetermined position.