Patents Assigned to Stanley Electric Company, Ltd.
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Patent number: 5161875Abstract: To correct variation of a property of light orientation induced by inclination of a vehicle body during a cornering operation, a projector type cornering head lamp including an inclination sensor further includes correcting means. When the correcting means is mechanically constructed, it comprises a pair of opening portions formed on a light shielding plate, shutters for closing the opening portions therewith and solenoids for pulling the shutter downwardly in response to an output from the inclination sensor. When the correcting means is electrically constructed, it is constituted by a circular liquid crystal element preferably comprising a supertwistnematic liquid crystal and serving also as a light shielding plate.Type: GrantFiled: August 22, 1991Date of Patent: November 10, 1992Assignee: Stanley Electric Company, Ltd.Inventors: Tsuneo Sekiguchi, Koichi Nagano, Satoru Suzuki
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Patent number: 5146162Abstract: In the revolution frequency indication apparatus in which the revolution frequency of a rotating body is measured and indicated according to a sensor pulse obtained from a revolution sensor mounted on said rotating body or its surrounding, a revolution frequency indication apparatus comprising an indication updating time counter circuit which counts predetermined indication updating time intervals, and a revolution frequency measurement portion which measures the revolution frequency of said rotating body by means of a sensor pulse entered within a measurement time interval of said counter circuit.Type: GrantFiled: October 26, 1990Date of Patent: September 8, 1992Assignee: Stanley Electric Company, Ltd.Inventors: Hideyuki Kamiyama, Masahiro Sasaki, Youji Oki
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Patent number: 5055993Abstract: An inverter apparatus for converting a direct current which flows through the primary side of an output transformer to an alternating current which is outputted from the secondary side of the transformer. Switching elements are used to interrupt the flow of the direct current through the primary of the output transformer and frequency control means is provided for driving the switching elements at the resonant frequency of the resonant circuit formed by the secondary of the output transformer and the load. A circuit for altering the pulse width of the output signal is also provided for controling the power delivered to the load.Type: GrantFiled: December 8, 1989Date of Patent: October 8, 1991Assignee: Stanley Electric Company, Ltd.Inventors: Osamu Miyata, Katsunori Kawano, Youji Oki
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Patent number: 4937150Abstract: An ultrafine grain fluorescent body comprises an ultrafine grain luminescent material containing an activator and having a surface carrying thereon a layer which is formed from a different material from the luminescent material, or which has different properties from those of the luminescent material. The layer forms a heterojunction or p-n junction defining a luminescent mechanism in an interface between the luminescent material and the layer. The heterojunction is formed if the layer is a film of oxide, nitride or any other different substance formed on the surface of the luminescent material, e.g. ZnS, having a grain size of several hundred to several thousand angstroms. Alternatively, the p-n junction is formed if the luminescent material is a p-type (or n-type) semiconductor, and if the layer is a film of an n-type (or p-type) a semiconductor formed on the surface thereof.Type: GrantFiled: December 23, 1988Date of Patent: June 26, 1990Assignees: Research Development Corporation, Stanley Electric Company, Ltd.Inventor: Katsura Tsukada
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Patent number: 4671446Abstract: The bonding of a lead wire on a semiconductor having an ohmic contact metal electrode provided locally on a surface at a selected location is achieved through detecting the image of the metal electrode more precisely by enhancing the contrast between the metal electrode and the semiconductor surface. The enhanced contrast is accomplished by illuminating the contact-carrying surface at Brewster's angle with a beam of light rays having a wavelength in the range of the light transmission coefficient of the semiconductor material constituting the chip, and polarizing either the illuminating beam or the reflected beam or both to produce a difference in intensity of light between the contact and the light reflected from the semiconductor area. The illuminating light beam may be passed through a filter means to render a narrow frequency beam of light rays.Type: GrantFiled: December 27, 1985Date of Patent: June 9, 1987Assignee: Stanley Electric Company, Ltd.Inventor: Rand C. Sherman
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Patent number: 4584461Abstract: A planar heater for a liquid crystal element includes a thin metal plate having a relatively high specific resistance such as stainless, nichrome, nickel-chrome iron alloy, etc. The thin metal plate is subjected to etching-working to form a mesh-like heat generating body, opposite ends of which are provided with terminal portions for connection into an electrical circuit.Type: GrantFiled: January 19, 1983Date of Patent: April 22, 1986Assignee: Stanley Electric Company, Ltd.Inventors: Toru Teshima, Kazuo Ariga, Mitsunari Yoshida
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Patent number: 4486364Abstract: A lens for a light emitting diode is formed by inserting a pair of lead frames into a mold having grooves for snugly receiving the outer free ends of the lead frames. The outer-most edge of the lead frame free ends engage the base of the mold, thereby precisely locating the light emitting element, mounted on the lead frames, relative to the top surface of the lens. The snug fit for the outer free ends assures that the outer free ends are free of the resin to facilitate alignment of the finished product in an electro-optical circuit and to provide improved radiation of heat to the atmosphere.Type: GrantFiled: June 29, 1982Date of Patent: December 4, 1984Assignee: Stanley Electric Company, Ltd.Inventor: Kaoru Takahashi
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Patent number: 4441248Abstract: On-line inspection of electric characteristics of a semiconductor device can be achieved during a step of bonding a lead wire to a chip surface of the semiconductor device in the process of fabricating an electronic component, by the use of a circuit arrangement formed between a lead wire fed from a bonder and connectors serving as electric terminals when the chip is mounted thereon to be made into an electronic component, and by the application of electric power thereto.Type: GrantFiled: December 2, 1982Date of Patent: April 10, 1984Assignee: Stanley Electric Company, Ltd.Inventors: Rand C. Sherman, Van E. Wood