Abstract: A new technology in semiconductor electronics is provided wherein basic semiconductor elements (BSEs) are fabricated on the surfaces of hollow, cone-shaped and/or other planar or non-planar substrata. Photosensitive and photoemitting elements are included within each BSE capable of transmitting and receiving signals to and from external sources in a direction that is non-parallel (oblique) to the silicon surface and circuitry plane. Inter-BSE communication are also achieved via fiber optic connectors. In one embodiment, the BSEs may be assembled in an efficient arrangement whereby some number of BSEs (for example, six (6)) are located adjacent and surrounding another "polar" BSE, thereby providing for short opto-electronic connections between the polar BSE and its neighbors. In additional embodiments, a power supply may reside within the internal space of the BSE, and the interior and exterior of the BSEs are designed as opposite electrical poles, thereby providing power to the BSEs.

Abstract: A new technology in semiconductor electronics is provided wherein basic semiconductor elements (BSEs) are fabricated on the surfaces of hollow, cone-shaped and/or other planar or non-planar substrata. Photosensitive and photoemitting elements are included within each BSE capable of transmitting and receiving signals to and from external sources in a direction that is non-parallel (oblique) to the silicon surface and circuitry plane. Inter-BSE communication are also achieved via fiber optic connectors. In one embodiment, the BSEs may be assembled in an efficient arrangement whereby some numbers of BSEs (for example, six (6)) are located adjacent and surrounding another "polar" BSE, thereby providing for short opto-electronic connections between the polar BSE and its neighbors.