Abstract: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end module can comprise a single robot, a transfer station, and a plurality of end effectors. The processing module is coupled with the front-end module such that the single robot delivers objects from the storage device to the processing module. The processing module comprising a rotating table, and a spindle with a carrier configured to retrieve the delivered object and process the object on the rotating table.

Abstract: The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.

Abstract: The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.

Abstract: A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.

Abstract: A method for preparing a semiconductor wafer for whole wafer backside inspection is disclosed. The frontside of the wafer is covered with a protective frontside substrate and the backside portion of the wafer is thinned using conventional techniques. The whole wafer backside is then polished and a backside substrate, preferably of transparent material is juxtaposed to the backside of the wafer, such as with an adhesive or with a frame. The frontside substrate is then removed, exposing electronic devices for device inspection. The backside of the wafer is maintained open or available to backside inspection such as emission microscopy techniques used to detect defects which emit light.

Abstract: A method for preparing a semiconductor wafer for whole wafer backside inspection is disclosed. The frontside of the wafer is covered with a protective frontside substrate and the backside portion of the wafer is thinned using conventional techniques. The whole wafer backside is then polished and a backside substrate, preferably of transparent material is juxtaposed to the backside of the wafer, such as with an adhesive or with a frame. The frontside substrate is then removed, exposing electronic devices for device inspection. The backside of the wafer is maintained open or available to backside inspection such as emission microscopy techniques used to detect defects which emit light.