Patents Assigned to Substrate Systems, Inc.
  • Patent number: 4640651
    Abstract: A method for machining a thin workpiece to equalize machining induced stresses within the workpiece. The method produces a thin workpiece on which the machining lines intersect on the workpiece's machined surface. The method includes passing the workpiece under a fly cutter while at the same time rotating the workpiece.
    Type: Grant
    Filed: December 28, 1984
    Date of Patent: February 3, 1987
    Assignee: Substrate Systems, Inc.
    Inventor: Robert C. Runyon