Patents Assigned to SUGON DATAENERGY(BEIJING) CO., LTD
  • Patent number: 11452239
    Abstract: The present invention relates to a method for enhancing boiling performance of chip surface comprising steps of mounting a heat pipe directly above the surface of the chip, and forming a porous structure for increasing the vaporization core on an upper surface of the heat pipe. Performing an enhancing treatment in boiling of the upper surface of the heat pipe by mounting the heat pipe directly above the chip makes a temperature field of the boiling surface uniform, increases the boiling area and vaporization core, strengthens the boiling heat transfer, and reduces the core temperature of the chip.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: September 20, 2022
    Assignee: SUGON DATAENERGY(BEIJING) CO., LTD
    Inventors: Jisheng He, Chen Wang, Peng Zhang, Hongjie Wu, Jingnan Peng, Xing Li, Zhen Sun, Xintao Cui
  • Patent number: 11404735
    Abstract: The present invention relates to an immersed heat dissipation device for power battery, comprising a battery heat dissipation module, a battery unit, a liquid refrigerant, a main inlet pipe and a main outlet pipe, wherein the battery heat dissipation module is a structure of sealed box that contains the liquid refrigerant, and a plurality of the battery heat dissipation modules are connected to each other and arranged in the heat dissipation device for power battery. The battery can be effectively cooled and the temperature of the battery can be effectively controlled, and ensure a uniform temperature for the battery unit, thereby improving the performance and life of the power battery of new energy vehicle.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: August 2, 2022
    Assignee: SUGON DATAENERGY (BEIJING) CO., LTD
    Inventors: Jisheng He, Xintao Cui, Peng Zhang, Bingshuang Li, Chen Wang, Hongjie Wu, Lei Han, Yingjun Wu, Jiawei Liu, Shuai Zhang, Zhihong Zhao
  • Patent number: 11317536
    Abstract: The application relates to a high-efficiency phase-change condenser for a supercomputer, including a condenser box body, a refrigerant input pipe, a refrigerant output pipe and a condensing coil; a liquid refrigerant accommodated in the condenser box body, and a gas-phase region existing between a liquid level of the liquid refrigerant and a top of the condenser box body; one portion of the condensing coil immersed into the liquid refrigerant, and the other portion of the condensing coil located in the gas-phase region above the liquid level of the liquid refrigerant; and in the gas-phase region, refrigerant vapor bubbles are liquified by the condensing coil. Liquid-phase and gas-phase saturated refrigerants can be completely condensed by the condensing coil in a limited condenser space, thereby improving heat exchange efficiency of the condenser.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: April 26, 2022
    Assignee: SUGON DATAENERGY(BEIJING) CO., LTD
    Inventors: Jisheng He, Xintao Cui, Lei Han, Bingshuang Li, Jiawei Liu, Yingjun Wu, Shuai Zhang, Zhihong Zhao, Chen Wang, Hongjie Wu, Peng Zhang