Patents Assigned to Sumitomo Electric Industries, Ltd.
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Patent number: 11914194Abstract: An optical connection structure includes a MCF, a first ferrule, a plurality of optical fibers, and a second ferrule. The MCF includes first cores and a first cladding. The first ferrule has a first inner hole and a first ferrule end surface. Each optical fiber optically connected to the MCF includes a second core and a second cladding. The second ferrule has a second inner hole housing tip parts of the optical fibers, and a second ferrule end surface. The second ferrule fixes the tip parts of the optical fibers in the second inner hole by an adhesive. The adhesive is packed in the second inner hole such that a surface of the adhesive is recessed from the second ferrule end surface into the second inner hole. A refractive-index matching material is applied in a space sealed by the first ferrule end surface and the second ferrule end surface.Type: GrantFiled: May 27, 2022Date of Patent: February 27, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Osamu Shimakawa
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Patent number: 11916519Abstract: A high frequency amplifier includes an asymmetrical Doherty amplifier having a carrier amplifier, a peak amplifier, a branch circuit, and a phase adjusting circuit, a driver amplifier, and a base member mounting a first circuit board mounting the driver amplifier, the carrier amplifier, and the peak amplifier and a second circuit board mounting the circuits. The branch circuit divides a path of a RF signal into input paths of the peak and carrier amplifiers. The driver amplifier, the carrier amplifier, and the peak amplifier have rear surfaces in contact with the base member. The electrical length from the output terminal of the driver amplifier to the input terminal of the peak amplifier, when converted based on a phase of the signal, is from (2n+1)×???/4 to (2n+1)×?+?/4, where n is an integer greater than or equal to zero.Type: GrantFiled: April 5, 2021Date of Patent: February 27, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Tatsuya Hashinaga, Yutaka Moriyama
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Patent number: 11915843Abstract: A multicore cable includes a plurality of covered wires having a lubricant powder provided on surfaces thereof, and an outer sheath layer covering outer surfaces of the plurality of covered wires. The outer surfaces of the plurality of covered wires, and the outer sheath layer, make contact with one another via the lubricant powder. A coverage of the outer surfaces of the plurality of covered wires by the lubricant powder is greater than or equal to 15%.Type: GrantFiled: January 10, 2023Date of Patent: February 27, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hirotaka Kato, Jo Yagisawa, Takumi Ooshima, Takaya Kohori
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Patent number: 11913135Abstract: A silicon carbide substrate has a first main surface and a second main surface opposite to the first main surface. The silicon carbide substrate includes screw dislocations and pits having a maximum diameter of 1 ?m or more and 10 ?m or less in a direction parallel to the first main surface. When the screw dislocations and the pits are observed in the first main surface, a percentage obtained by dividing a number of the pits by a number of the screw dislocations is 1% or less. A concentration of magnesium in the first main surface is less than 1×1011 atoms/cm2.Type: GrantFiled: November 10, 2020Date of Patent: February 27, 2024Assignee: Sumitomo Electric Industries, Ltd.Inventors: Kyoko Okita, Tsubasa Honke, Shunsaku Ueta
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Patent number: 11916029Abstract: A semiconductor device of the present disclosure includes: a semiconductor substrate having a first main surface; a first aluminum electrode having a first surface facing the first main surface and a second surface opposite to the first surface, the first aluminum electrode being disposed on the semiconductor substrate; a passivation film that covers a peripheral edge of the second surface and that is provided with an opening from which a portion of the second surface is exposed; and a copper film. The second surface exposed from the opening is provided with a recess that is depressed toward the first surface. The copper film is disposed in the recess.Type: GrantFiled: March 10, 2020Date of Patent: February 27, 2024Assignee: Sumitomo Electric Industries, Ltd.Inventors: Mitsuhiko Sakai, Hirotaka Oomori
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Patent number: 11913096Abstract: A cemented carbide composed of a first hard phase, a second hard phase and a binder phase, in which the first hard phase is composed of tungsten carbide particles, the second hard phase is composed of at least one first compound selected from the group consisting of TiNbC, TiNbN and TiNbCN, the second hard phase has an average particle diameter of 0.25 ?m or less, the second hard phase has a dispersity of more than 0.70 and 17.0 or less, the second hard phase has a content of 0.1 vol % or more and 15 vol % or less, the binder phase contains at least one first element selected from the group consisting of iron, cobalt and nickel, and the binder phase has a content of 0.1 vol % or more and 19.0 vol % or less.Type: GrantFiled: November 18, 2022Date of Patent: February 27, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Yasuki Kido, Yoshihiro Kimura, Anongsack Paseuth
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Publication number: 20240063249Abstract: A method of manufacturing a photo detector includes preparing a substrate having a first main surface and a second main surface opposite to the first main surface, forming a semiconductor layer on the first main surface, forming a passivation layer having an opening on the semiconductor layer, forming an electrode on the semiconductor layer exposed through the opening, bringing the passivation layer into contact with an etchant after the electrode is formed, and inspecting characteristics after the bringing into contact with an etchant. In the method, the etchant has a higher etching rate for the semiconductor layer than the passivation layer.Type: ApplicationFiled: June 13, 2023Publication date: February 22, 2024Applicant: Sumitomo Electric Industries, Ltd.Inventor: Takeshi OKADA
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Publication number: 20240059877Abstract: A resin composition contains: a base resin including a polyolefin; a modified polyolefin obtained by grafting a polar group onto a polyolefin; and an inorganic filler including magnesium oxide and surface-treated with a silane coupling agent. A remaining rate R of the inorganic filler in a fractured frozen surface is 50% or more. The remaining rate R is calculated using the following expression (1). R=(Df/Dc)×100 . . . (1). Df represents a density of the inorganic filler remaining in a fractured surface of a sheet formed of the resin composition containing the base resin, the modified polyolefin, and the inorganic filler, when the sheet is immersed in liquid nitrogen for 1 hour and then fractured. Dc represents a reference density of the inorganic filler detected in a cut surface of the sheet formed of the resin composition, when the sheet is cut at 24° C. using a focused ion beam without being frozen.Type: ApplicationFiled: December 16, 2021Publication date: February 22, 2024Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Shoma SUZUKI, Kohei HOSOMIZU, Takanori YAMAZAKI
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Publication number: 20240063497Abstract: A wiring module is a wiring module that is mounted on a plurality of power storage elements. The wiring module includes busbars that are connected to electrode terminals of the plurality of power storage elements, flexible substrates that are connected to busbar-side connection parts provided at the busbars, a circuit substrate that is connected to the flexible substrates, and a protector on which the busbars, the flexible substrates, and the circuit substrate are placed. An upper surface of the circuit substrate is disposed above upper surfaces of the busbar-side connection parts.Type: ApplicationFiled: January 6, 2022Publication date: February 22, 2024Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Nobuyuki MATSUMURA, Shinichi TAKASE
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Publication number: 20240059864Abstract: A resin composition contains a base resin including a polyolefin and an inorganic filler including silicon dioxide and surface-treated with a silane coupling agent. A remaining rate R of the inorganic filler in a fractured frozen surface is 50% or more. The remaining rate R is calculated using the following expression (1). R=(Df/Dc)×100 . . . (1). Df represents a density of the inorganic filler remaining in a fractured surface of a sheet formed of the resin composition containing the base resin and the inorganic filler, when the sheet is immersed in liquid nitrogen for 1 hour and then fractured. Dc represents a reference density of the inorganic filler detected in a cut surface of the sheet formed of the resin composition, when the sheet is cut at 24° C. using a focused ion beam without being frozen.Type: ApplicationFiled: December 16, 2021Publication date: February 22, 2024Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Kohei HOSOMIZU, Shoma SUZUKI, Takanori YAMAZAKI
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Publication number: 20240062126Abstract: The information providing system includes: a working terminal; and an instructing terminal that communicates with the working terminal. The working terminal includes: a working communication device that outputs imaging information including an image of the facility captured with a camera; and a working display that displays working information concerning the work carried out in the facility. The instructing terminal includes: an instructing display that displays the captured image based on the imaging information; an interface that receives instructing information serving to offer an instruction for the work carried out in the facility; and an instructing communication device that outputs the instructing information. The working terminal displays, on the working display, the captured image processed based on the imaging information and the instructing information, as the working information.Type: ApplicationFiled: January 14, 2021Publication date: February 22, 2024Applicant: Sumitomo Electric Industries, Ltd.Inventors: Takashi YAMAMOTO, Masanobu OE
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Patent number: 11910714Abstract: A thermoelectric conversion material contains a matrix composed of a semiconductor and nanoparticles disposed in the matrix, and the nanoparticles have a lattice constant distribution ?d/d of 0.0055 or more.Type: GrantFiled: August 11, 2021Date of Patent: February 20, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masahiro Adachi, Makoto Kiyama, Yoshiyuki Yamamoto, Ryo Toyoshima
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Patent number: 11908610Abstract: An inductor includes: a magnetic core; a conduction path penetrating the magnetic core; a pedestal portion including a core holding portion that holds the magnetic core, and support portions that support, when placed on a circuit board, electronic components at a height at which the electronic components can be accommodated on the circuit board side with respect to the core holding portion; and a shield portion that is provided on the circuit board side with respect to the magnetic core, and that shields a magnetic field generated by flow of electricity in the conduction path.Type: GrantFiled: January 25, 2019Date of Patent: February 20, 2024Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Toshiyuki Tsuchida, Shigeki Yamane, Junya Aichi
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Patent number: 11908613Abstract: A reactor includes: a coil; a magnetic core arranged inside of the wound portion and an outer core portion arranged outside of the wound portion; and a resin molded portion. An interval between the wound portion and the inner core portion differs in a peripheral direction of the wound portion. The reactor includes an electrically insulating material that is interposed in a location at which the interval is the narrowest, and a thick portion that is interposed in a location at which the interval is the widest and forms a portion of the inner resin portion. The proportion of the interval of the narrowest location with respect to the thermal conductivity is less than the proportion of the interval with respect to the thermal conductivity.Type: GrantFiled: February 19, 2019Date of Patent: February 20, 2024Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Shinichiro Yamamoto, Kohei Yoshikawa
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Patent number: 11906803Abstract: An optical fiber ribbon includes a plurality of optical fiber cores arranged in parallel in a direction orthogonal to a longitudinal direction of the optical fiber cores, and a coupling member configured to couple the plurality of optical fiber cores. In the optical fiber ribbon, a plurality of coupled sections and a plurality of separate sections are alternately provided in the longitudinal direction. Each of the plurality of coupled sections is in a state in which all of the adjacent optical fiber cores are coupled by the coupling member. Each of the plurality of separate sections is in a state in which at least two of the optical fiber cores adjacent to each other are not coupled by the coupling member.Type: GrantFiled: May 27, 2022Date of Patent: February 20, 2024Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., Sumitomo Electric Optifrontier Co., Ltd.Inventors: Takayuki Shimazu, Kenichiro Otsuka, Yuuki Shimoda, Shinji Yamane
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Patent number: 11908604Abstract: Provided is a composite material molded article including soft magnetic powder and resin containing the soft magnetic powder in a dispersed state. The composite material molded article is provided with a roughened region having an arithmetic average roughness Ra of 3.0 ?m or more on at least a portion of its surfaces.Type: GrantFiled: December 12, 2016Date of Patent: February 20, 2024Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Shintaro Nanbara, Takashi Takada, Kazushi Kusawake
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Patent number: 11908598Abstract: An insulated electric wire with a water-stopping portion has excellent water stopping performance and forms quickly, and a wire harness includes the insulated electric wire. An insulated electric wire includes: a conductor wherein multiple metal material elemental wires are twisted together; and an insulation covering covers an outer circumference of the conductor. The insulated electric wire includes an exposed portion wherein the insulation covering is removed; a covered portion wherein the insulation covering covers the conductor, the exposed and covered portions are adjacent to each other in a longitudinal axis direction; and a water-stopping portion wherein gaps between the wires in the exposed portion are filled with a water-stopping agent. At least a portion of the water-stopping agent contacting the wires is made of a resin material that cures upon contact.Type: GrantFiled: January 30, 2019Date of Patent: February 20, 2024Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Kenichiro Araki, Toyoki Furukawa
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Publication number: 20240053535Abstract: A method for manufacturing an optical fiber includes: melting an optical fiber preform and drawing a glass fiber; applying a resin composition to an outer periphery of the glass fiber; and curing the resin composition applied, wherein an amount of eccentricity of a central axis of the glass fiber, in a cross section perpendicular to the central axis of the glass fiber, from a central axis relative to an outer periphery of the resin composition or an outer periphery of a coating resin layer formed by curing the resin composition is measured at 50 points or more over a length range of 50 m or more of the glass fiber, and wherein the resin composition is applied such that a mean value a and a standard deviation a of the amount of eccentricity satisfy a+3??10 ?m.Type: ApplicationFiled: August 2, 2023Publication date: February 15, 2024Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Takahiro NOMURA, Kazuyuki SOHMA, Iwao OKAZAKI
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Publication number: 20240057294Abstract: Disclosed is a circuit assembly having a novel structure capable of reducing thermal resistance in a heat-dissipating path and increasing heat dissipation while ensuring insulation between a heat-dissipating portion and a heat-dissipation target. A circuit assembly includes: heat-generating components that generate heat as a result of a current flowing therethrough; metal plates connected to connecting portions of the heat-generating components, and each having a heat-dissipating portion configured to come into thermal contact with an external heat-dissipation target; a case accommodating the heat-generating components and the metal plates, and having opening portions that expose the heat-dissipating portions of the metal plates to an outside; and an insulating film sealing the opening portions of the case and fixed to the case.Type: ApplicationFiled: December 14, 2021Publication date: February 15, 2024Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Taiji YANAGIDA, Hiroki SHIMODA
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Publication number: 20240053567Abstract: A method for manufacturing a colored optical fiber includes: a step of feeding colored resin into a die; a step of causing a coated optical fiber to pass through the inside of the die and applying the colored resin to a periphery of the coated optical fiber to form a colored optical fiber including a colored layer; a step of detecting a color of the colored layer; and a step of determining whether the detected color is good or bad.Type: ApplicationFiled: November 29, 2021Publication date: February 15, 2024Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Hiroshi KOHDA
