Abstract: A flexible printed circuit board includes: an electrically insulating substrate layer; an electrically conductive pattern stacked on at least one surface of the substrate layer; and a cover layer that is disposed on a stack including the substrate layer and the electrically conductive pattern and covers a surface of the stack, which surface is on the side on which the electrically conductive pattern is present. The electrically conductive pattern has a coil region including a coil. In the substrate layer or the cover layer, a high-magnetic permeability member is present in at least a region that overlaps the coil region in plan view.

Abstract: According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.

Abstract: A connection module includes a FPC and bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other. The FPC includes a first wiring portion, a second bus bar mount portion, and a third bus bar mount portion to which the bus bars are connected. The FPC further includes a second expandable/contractable portion and a third expandable/contractable portion. The second expandable/contractable portion is continuous from the second bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the first wiring portion and the third bus bar mount portion. The third expandable/contractable portion is continuous from the third bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the second bus bar mount portion.

Abstract: A connection module includes a FPC, bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other, and a resin protector holding the bus bars and the FPC. The FPC includes a FPC body member and a first deformable portion that connects the FPC body member and the bus bars. The resin protector includes a FPC holding portion to which the FPC body member is fixed, movable bus bar holding portions to which the bus bars are fixed, respectively, and second deformable portions that connect the FPC holding portion and the movable bus bar holding portions. The first deformable portion and the second deformable portion connect the bus bars and the movable bus bar holding portions to the FPC body member and the FPC holding portion, respectively, such that the bus bars and the movable bus bar holding portions are movable with respect to the FPC body member and the FPC holding portion.

Abstract: A connection module is a module mounted on a power storage element group including power storage elements having electrode terminals and connecting the power storage elements. The connection module includes a FPC including wiring portions and bus bars connected to the wiring portions and connecting the electrode terminals of the power storage elements that are adjacent to each other. The FPC includes a first multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC and includes a second multi-layered portion including the wiring portions that are overlapped with each other by folding the FPC.

Abstract: A flexible printed circuit board of the present invention includes an insulating base film and an electrode stacked on a first surface of the base film, in which the electrode includes a low-melting-point metal layer on a surface of the electrode, and a plate- or strip-like rigid member electrically insulated from the electrode is disposed in a region of a second surface of the base film opposite from the electrode.

Abstract: A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.

Abstract: A printed wiring board includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated so as to run on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 ?m or greater to 50 ?m or smaller, and an average thickness of the second conductive portion is 1 ?m or greater to smaller than 8.5 ?m. A method for manufacturing a printed wiring board includes a first conductive portion forming step of forming a first conductive portion forming each wiring portion by plating an opening of the resist pattern on the conductive foundation layer, a conductive foundation layer removing step, and a second conductive portion coating step.

Abstract: A joint structure includes an end portion of the flat electric wire assembly, a terminal fitting, and solder. The flat electric wire assembly includes a conductive line, a first insulating layer covering the conductive line, and a second insulating layer covering a portion of the conductive line. The terminal fitting includes a joint portion that includes a receiving section on which the end portion is placed and blocking sections extending from the receiving section such that the end portion is between the blocking sections. The first insulating layer includes a first surface opposed to the receiving section and a second surface on which the conductive line is disposed. The conductive line includes an end portion different from the portion covered with the second insulating layer. The solder is disposed over the second surface. The blocking sections include surfaces over which the solder is not disposed.

Abstract: A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is ½ or more and 5 or less.

Abstract: A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.

Abstract: A sensor unit disclosed herein is a sensor unit that is to be mounted in a housing section included in a device, and the sensor unit includes a FPC including a detection line and having flexibility, a temperature sensor connected to a connection portion of the detection line on a surface of the FPC, and an elastic member disposed on the surface of the FPC so as to be elastically deformable. The elastic member is to be elastically compressed within the housing section to press a first plate member mounted on a back surface of the FPC toward the device by a resilient force.

Abstract: According to one aspect of the present invention, a printed circuit board includes: an insulating base film; a conductive pattern that is partially layered on a surface side of the base film; a coating layer that is layered on a surface of a layered structure including the base film and the conductive pattern and having an opening portion that partially exposes the conductive pattern; and a tin plating layer that is layered on a surface of the conductive pattern exposed from the opening portion, wherein an average peel length of the coating layer from the conductive pattern with an inner edge of the opening portion as a base end is less than or equal to 20 ?m.

Abstract: According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 ?m.

Abstract: A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.

Abstract: A printed circuit board according to one embodiment of the present invention is a printed circuit board including a plate-shaped or a sheet-shaped insulating material having a penetrating hole, and a metal plating layer layered on both surfaces of the insulating material and an inner peripheral surface of the insulating material, wherein an inner diameter of the penetrating hole monotonically decreases from a top surface of the insulating material toward a back surface, and wherein the inner diameter of the penetrating hole at a center in a thickness direction of the insulating material is smaller than an average of an opening diameter on the top side and an opening diameter on the back side.

Abstract: A wiring module includes a flat line that is mounted on a power storage element group including power storage elements and a line-side connector that is to be fitted to a device-side connector included in a control unit of the power storage element group. The flat line includes an extra section extending from the power storage element group and a bending restricting plate is disposed on a portion of the extra section.

Abstract: A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.

Abstract: A printed circuit board according to one aspect of the present invention includes an insulating layer having a through-hole, a conductive layer laminated on an inner circumferential surface of the through-hole, and metal plating layers laminated on a surface of the conductive layer facing opposite the insulating layer and laminated on both surfaces of the insulating layer, wherein an average thickness of the insulating layer is greater than or equal to 5 ?m and less than or equal to 50 ?m, wherein an average thickness of the metal plating layers is greater than or equal to 3 ?m and less than or equal to 50 ?m, wherein a hole diameter of the through-hole gradually increases from a first end of the through-hole at one surface of the insulating layer to a second end of the through-hole at another surface of the insulating layer, wherein the hole diameter of the through-hole at the first end is greater than or equal to 1.5 times, and less than or equal to 2.

Abstract: A flexible printed circuit board includes: an electrically insulating substrate layer; an electrically conductive pattern stacked on at least one surface of the substrate layer; and a cover layer that is disposed on a stack including the substrate layer and the electrically conductive pattern and covers a surface of the stack, which surface is on the side on which the electrically conductive pattern is present. The electrically conductive pattern has a coil region including a coil. In the substrate layer or the cover layer, a high-magnetic permeability member is present in at least a region that overlaps the coil region in plan view.