Abstract: A cover tape used for packaging of chip type electronic parts, which is heat-sealable to a plastic carrier tape having at given intervals pockets for accommodation of chip type electronic parts, characterized in that the outer layer is a biaxially oriented film consisting of polyester, polypropylene or nylon and the adhesion layer consists of a dispersion of conductive fine powders in a thermoplastic resin, said conductive fine powders consisting of tin oxide, zinc oxide, titanium oxide, carbon black or a Si-based organic compound, or their combination, said thermoplastic resin consisting of polyurethane resin, acrylic resin, polyvinyl chloride resin, ethylene-vinyl acetate resin or polyester resin, or their combination.