Abstract: A multi-stack semiconductor device comprises: a substrate; a first conductive layer, a first group of the semiconductor material layers and a second group of the semiconductor material layers. The first conductive layer is formed on the substrate scribed by laser on the bottom of the first conductive layer to form a plurality of the first scribe lines. The first group of the semiconductor material layers is formed on the first conductive layer, and the second group of the semiconductor material layers is formed on the first group of the semiconductor material layers. The first group of the semiconductor material layers and the second group of the semiconductor material layers are simultaneously scribed by laser on bottom of the first group of the semiconductor material layers to form a plurality of the second scribe lines. Each second scribe line is comprised of a plurality of the second pores.

Abstract: A method for increasing semiconductor device effective operation area, comprising following steps: depositing first conductive layer on the substrate; using laser for scribing a plurality of the first scribe lines on the first conductive layer, where the scribe lines are scribed on the bottom of the first conductive layer; depositing a plurality of the semiconductor material layers on the first conductive layer and in the plurality of the first scribe lines; using laser for scribing a plurality of the second scribe lines on the semiconductor material layer, where the scribe lines are scribed on the bottom of the semiconductor material layer, each second scribe line is comprised of a plurality of the second pores; depositing a second conductive layer on the semiconductor material layer and in the plurality of the first scribe lines and the plurality of the second scribe lines; using laser for scribing a plurality of the third scribe lines on the second conductive layer, where the scribe lines are scribed on th

Abstract: Disclosed is an improved structure for a fragile plate packaging and protection device, comprising: a box main body provided with an accommodating space, a bottom plate, two first fixing elements, two second fixing elements, and a plurality of buffer elements having gaps. Wherein, said bottom plate is provided in said accommodating space of said box main body, and is in contact with a bottom portion of said box main body; said two first fixing elements are provided in said accommodating space of said box main body face-to-face, and are disposed vertically at a bottom portion of said box main body; said two second fixing elements are disposed on said two first fixing elements respectively, thus ensuring better safety protection of said fragile plate in said box main body during transportation.