Abstract: Novel memory cells utilize source-side injection, allowing very small programming currents. If desired, to-be-programmed cells are programmed simultaneously while not requiring an unacceptably large programming current for any given programming operation. In one embodiment, memory arrays are organized in sectors with each sector being formed of a single column or a group of columns having their control gates connected in common. In one embodiment, a high speed shift register is used in place of a row decoder to serially shift in data for the word lines, with all data for each word line of a sector being contained in the shift register on completion of its serial loading. In one embodiment, speed is improved by utilizing a parallel loaded buffer register which receives parallel data from the high speed shift register and holds that data during the write operation, allowing the shift register to receive serial loaded data during the write operation for use in a subsequent write operation.

Abstract: A file structure employed in a flash electrically erasable and programmable read only memory ("EEPROM") system and aspects of forming and using certain data fields within such a file structure. An array of rows and columns of EEPROM memory cells is divided into blocks of cells that are separately addressable for the purpose of erasing an entire block of cells at the same time. Each block contains several rows of cells with certain columns thereof storing a sector of data, typically 512 bytes of data, and other columns of cells within the same rows being used as spare cells to replace any defective sector data cells and store overhead (header) information about the block and the data sector. Such overhead information includes pointers to locations of any defective sector data cells within the block, whether the block has been mapped out in favor of another block, error correction codes for the sector data and the header information, and other similar types of information.

Abstract: A file structure employed in a flash electrically erasable and programmable read only memory ("EEPROM") system and aspects of forming and using certain data fields within such a file structure. An array of rows and columns of EEPROM memory cells is divided into blocks of cells that are separately addressable for the purpose of erasing an entire block of cells at the same time. Each block contains several rows of cells with certain columns thereof storing a sector of data, typically 512 bytes of data, and other columns of cells within the same rows being used as spare cells to replace any defective sector data cells and store overhead (header) information about the block and the data sector. Such overhead information includes pointers to locations of any defective sector data cells within the block, whether the block has been mapped out in favor of another block, error correction codes for the sector data and the header information, and other similar types of information.

Abstract: A charge pump circuit comprises a plurality of voltage doubler circuits connected together such that a first voltage output generated by a first portion of a kth one of the voltage doubler circuits is substantially equal to Vdd*2.sup.k and Vdd*2.sup.k-1) on odd and even phases, respectively, of a first clock signal, and a second voltage output generated by a second portion of the kth one of the voltage doubler circuits is substantially equal to Vdd*2.sup.k-1) and Vdd*2.sup.k on the odd and even phases, respectively, of the first clock signal. Each of the voltage doubler circuits is constructed such that when its first portion is providing a voltage of Vdd*2.sup.k and a current to a next stage, its second portion is recharging a capacitor in that portion to Vdd*2.sup.k-1), and when its second portion is providing a voltage of Vdd*2.sup.2 and a current to the next stage, its first portion is recharging a capacitor in that portion to Vdd*2.sup.k-1).

Abstract: A memory system includes an array of solid-state memory devices which are in communication with and under the control of a controller module via a device bus with very few lines. This forms an integrated-circuit mass storage system which is contemplated to replace a mass storage system such as a disk drive memory in a computer system. Command, address and data information are serialized into component strings and multiplexed before being transferred between the controller module and the array of memory devices. The serialized information is accompanied by a control signal to help sort out the multiplexed components. Each memory device in the array is mounted on a multi-bit and assigned an array address. A memory device is selected by an appropriate address broadcast over the device bus, without requiring the usual dedicated select signal. A particular multi-bit mount configuration is used to unconditionally select the device mounted thereon.

Abstract: A memory system having a two dimensional array of EEPROM or Flash EEPROM cells is addressable by rows and columns. A word line is connected to the control gates of all the cells in each row, an erase line is connected to all the erase gates of each sector of cells, and a pair of bit lines are connected respectively to all the sources and drains of each column of cells. The memory system incorporates a word line current detector and an erase line current detector in addition to the usual bit line current detectors. The leakage current of each of the lines are measured after predetermined memory events such as program or erase operations. When a defective row or column is detected, it is electrically isolated from other columns by programming and is mapped out and replaced. Data recovery schemes include reading a defective column by a switched-memory-source-drain technique.

Abstract: A method and circuit programs and automatically verifies the programming of selected EEPROM cells without alternating between programming and reading modes like prior art methods and circuitry. The circuitry includes a programming circuit and a bit line voltage regulation circuit. The programming circuit further includes a novel sense amplifier which unlike prior art sense amplifiers, is operable during both cell reading and programming modes. Included in the sense amplifier are two current providing circuits. A first circuit provides current to a selected EEPROM cell which is sufficient for reading the programmed state of the cell, and a second circuit which automatically provides additional current when required, for programming the cell. The sense amplifier detects when programming of a selected EEPROM cell has completed and causes programming of that cell to be terminated. The voltage regulation circuitry regulates the bit line voltage to the selected EEPROM cell's drain electrode.

Abstract: A system of Flash EEprom memory chips with controlling circuits serves as non-volatile memory such as that provided by magnetic disk drives. Improvements include selective multiple sector erase, in which any combinations of Flash sectors may be erased together. Selective sectors among the selected combination may also be de-selected during the erase operation. Another improvement is the ability to remap and replace defective cells with substitute cells. The remapping is performed automatically as soon as a defective cell is detected. When the number of defects in a Flash sector becomes large, the whole sector is remapped. Yet another improvement is the use of a write cache to reduce the number of writes to the Flash EEprom memory, thereby minimizing the stress to the device from undergoing too many write/erase cycling.

Abstract: Various optimizing techniques are used for erasing semiconductor electrically erasable programmable read only memories (EEPROM). An erase algorithm accomplishes erasing of a group of memory cells by application of incremental erase pulses. Techniques include a 2-phase verification process interleaving between pulse applications; special handling of a sample of cells within each erasable unit group; defects handling; and adaptive initial erasing voltages. A streamlined write operation on a flash sector of the EEPROM is implemented by employing the optimized erase in an efficient manner. The write operation includes an initial quick erase of the sector followed by programming of data and verification. Only on those infrequent occasions when a failure occurs as manifested during program verification that the optimized erase will need be evoked.

Abstract: A memory array of PROM, EPROM or EEPROM cells has each cell formed in a trench of a thick oxide layer deposited on a silicon substrate, in a manner that a significant portion of opposing areas of the floating gate and control gate of each cell which provide capacitive coupling between them are formed vertically. This allows the density of the array to be increased since the amount of semiconductor substrate area occupied by each cell is decreased without having to sacrifice the amount or quality of the capacitive coupling. Further, a technique of forming capacitive coupling between the floating gate and an erase gate in a flash EEPROM array cell with improved endurance is disclosed.

Abstract: Various optimizing techniques are used for erasing semiconductor electrically erasable programmable read only memories (EEPROM), An erase algorithm accomplishes erasing of a group of memory cells by application of incremental erase pulses, Techniques include a 2-phase verification process interleaving between pulse applications; special handling of a sample of cells within each erasable unit group; defects handling; adaptive initial erasing voltages; and single- and hybrid-phase algorithms with sector to sector estimation of erase characteristics by table lookup. Techniques are also employed for controlling the uniformity of program/erase cycling of cells in each erasable unit group, Defects handling includes an adaptive data encoding scheme.

Abstract: A memory array of PROM, EPROM or EEPROM cells has each cell formed in a trench of a thick oxide layer deposited on a silicon substrate, in a manner that a significant portion of opposing areas of the floating gate and control gate of each cell which provide capacitive coupling between them are formed vertically. This allows the density of the array to be increased since the amount of semiconductor substrate area occupied by each cell is decreased without having to sacrifice the amount or quality of the capacitive coupling. Further, a technique of forming capacitive coupling between the floating gate and an erase gate in a flash EEPROM array cell with improved endurance is disclosed.

Abstract: In an array of solid-state memory cells organized into rows and segmented columns and addressable by wordlines and bit lines, a memory cell within a segmented column is addressable by segment-select transistors which selectively connect the memory cell's pair of bit lines via conductive lines running parallel to the columns to a column decode circuit. The disposition of the segment-select transistors and the conductive lines relative to the segmented columns enables one segment-select transistor to fit in every two or more columns. In one embodiment, the segment-select transistors have double the pitch of the columns while the conductive lines have the same pitch of the columns. In another embodiment, the segment-select transistor have four times the pitch of the columns while the conductive lines have double the pitch of the columns. This enables the use of larger size segment-select transistors which are necessary for passing higher currents in devices such as EPROM or flash EEPROM.

Abstract: Novel memory cells utilize source-side injection, allowing very small programming currents. If desired, to-be-programmed cells are programmed simultaneously while not requiring an unacceptably large programming current for any given programming operation. In one embodiment, memory arrays are organized in sectors with each sector being formed of a single column or a group of columns having their control gates connected in common. In one embodiment, a high speed shift register is used in place of a row decoder to serially shift in data for the word lines, with all data for each word line of a sector being contained in the shift register on completion of its serial loading. In one embodiment, speed is improved by utilizing a parallel loaded buffer register which receives parallel data from the high speed shift register and holds that data during the write operation, allowing the shift register to receive serial loaded data during the write operation for use in a subsequent write operation.

Abstract: A system of Flash EEprom memory chips with controlling circuits serves as non-volatile memory such as that provided by magnetic disk drives. Improvements include selective multiple sector erase, in which any combinations of Flash sectors may be erased together. Selective sectors among the selected combination may also be de-selected during the erase operation. Another improvement is the ability to remap and replace defective cells with substitute cells. The remapping is performed automatically as soon as a defective cell is detected. When the number of defects in a Flash sector becomes large, the whole sector is remapped. Yet another improvement is the use of a write cache to reduce the number of writes to the Flash EEprom memory, thereby minimizing the stress to the device from undergoing too many write/erase cycling.

Abstract: A novel method and structure are taught for narrowing the distribution of charge on the floating gates after electrical erasure of a population of cells. This allows faster programming following erasure. An additional recovery step is performed after erasure and prior to programming. The recovery step serves to adjust the state of erasure of the cells such that the distribution of the amount of erasure of each cell in the population of cells is reduced. This is accomplished in order to cause those cells which would have a relatively high floating gate voltage V.sub.FG after erasure to be recovered such that their floating gate voltage is made less positive, while having little or no effect on the floating gate voltage of cells which are not overerased. The recovery is performed either as a final step in the erase operation, a separate recovery step independent of the erase or program operations, or as a preliminary step during the programming operation.

Abstract: Various optimizing techniques are used for erasing semiconductor electrically erasable programmable read only memories (EEPROM). An erase algorithm accomplishes erasing of a group of memory cells by application of incremental erase pulses. Techniques include a 2-phase verification process interleaving between pulse applications; special handling of a sample of cells within each erasable unit group; defects handling; adaptive initial erasing voltages; and single-and hybrid-phase algorithms with sector to sector estimation of erase characteristics by table lookup. Techniques are also employed for controlling the uniformity of program/erase cycling of cells in each erasable unit group. Defects handling includes an adaptive data encoding scheme.

Abstract: A solid-state memory array such as an electrically erasable programmable read only memory (EEprom) or Flash EEprom array is used to store sequential data in a prescribed order. The memory includes a first information list containing addresses and defect types of previously detected defects. The defects are listed in the same prescribed order as that of the data. Only a simple controller is required to reference the information list so that writing or reading of the data will skip over the defective locations in the memory. New defects may be detected during writing by failure in verification, and those new defects will also be skipped. The memory also includes a second information list maintained by the controller. As data is written to the memory, addresses of file-markers and defects detected by write failure are entered into the list in the same prescribed order.

Abstract: Structures, methods of manufacturing and methods of use of electrically programmable read only memories (EPROM) and flash electrically erasable and programmable read only memories (EEPROM) include split channel and other cell configurations. An arrangement of elements and cooperative processes of manufacture provide self-alignment of the elements. An intelligent programming technique allows each memory cell to store more than the usual one bit of information. An intelligent erase algorithm prolongs the useful life of the memory cells. Use of these various features provides memory having a very high storage density and a long life, making it particularly useful as a solid state memory in place of magnetic disk storage devices in computer systems.

Abstract: Improvements in the circuits and techniques for read, write and erase of EEprom memory enable non-volatile multi-state memory to operate with enhanced performance over an extended period of time. In the improved circuits for normal read, and read between write or erase for verification, the reading is made relative to a set of threshold levels as provided by a corresponding set of reference cells which closely track and make adjustment for the variations presented by the memory cells. In one embodiment, each Flash sector of memory cells has its own reference cells for reading the cells in the sector, and a set of reference cells also exists for the whole memory chip acting as a master reference. In another embodiment, the reading is made relative to a set of threshold levels simultaneously by means of a one-to-many current mirror circuit.