Abstract: The present invention provides a method for manufacturing a touch electrode substrate, including the steps of (A) selecting a preset substrate for forming a substrate layer; (B) forming a conductive layer on at least one surface of the substrate layer; (C) depositing a photoresist on the conductive layer, performing a first exposure, and forming a first exposure pattern on the conductive layer; (D) performing a second exposure on the conductive layer, and forming a second exposure pattern on the conductive layer; (E) forming a shielding layer that has a circuit pattern, by means of developing the first exposure pattern and the second exposure pattern; and (F) processing the conductive layer and the shielding layer, to enable the conductive layer to form a plurality of metal circuits on at least one surface of the substrate layer.

Abstract: A shielding film includes an insulation layer, a conductive shielding layer and an adhesive layer; and is manufactured in a method including the steps of connecting a conductive shielding layer to a substrate material and forming a plurality of cavities on them; forming an insulation layer on the conductive shielding layer to fill up all the cavities; forming a carrier film on a top of the insulation layer; removing the substrate material from the conductive shielding layer, such that a plurality of downward protruded metal grounding electrodes are formed on a lower side of the conductive shielding layer corresponding to the cavities; and providing an adhesive layer on the lower side of the conductive shielding layer, such that the metal grounding electrodes are exposed from the adhesive layer to present a geometric pattern. The produced shielding film shows good grounding effect and bonding strength to ensure enhanced electromagnetic shielding effect.

Abstract: A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board.

Abstract: A shielding film includes an insulation layer, a conductive shielding layer and an adhesive layer; and is manufactured in a method including the steps of connecting a conductive shielding layer to a substrate material and forming a plurality of cavities on them; forming an insulation layer on the conductive shielding layer to fill up all the cavities; forming a carrier film on a top of the insulation layer; removing the substrate material from the conductive shielding layer, such that a plurality of downward protruded metal grounding electrodes are formed on a lower side of the conductive shielding layer corresponding to the cavities; and providing an adhesive layer on the lower side of the conductive shielding layer, such that the metal grounding electrodes are exposed from the adhesive layer to present a geometric pattern. The produced shielding film shows good grounding effect and bonding strength to ensure enhanced electromagnetic shielding effect.

Abstract: A method of manufacturing touch sensing electrode structure includes the steps of selecting a predetermined substrate material to form a substrate layer; forming at least one adhesion layer on the substrate layer; forming a masking layer with recessed lines on the adhesion layer; forming metal conductive electrodes in the recessed lines on the masking layer; removing the masking layer for the metal conductive electrodes to present a circuit pattern and etching off portions of the adhesion layer located between the metal conductive electrodes; and forming at least one weatherproof layer on peripheral surfaces of the metal conductive electrodes. The touch sensing electrode structure manufactured according to the above method has high yield rate and is weatherproof, and the metal conductive electrodes thereof have precisely controlled small width.

Abstract: A conductive electrode structure includes a substrate layer; at least one adhesion layer formed on the substrate layer for forming a circuit pattern; a conductive electrode layer formed on the adhesion layer for forming a conducting circuit corresponding to the circuit pattern; a first blackened layer formed on the conductive electrode layer corresponding to the circuit pattern and manufactured with an easily etched material; and a weatherproof layer formed on the first blackened layer and manufactured with an etch-resistant material. The weatherproof layer has a thickness smaller than the first blackened layer. The first blackened layer has a dark color for absorbing and stopping light from entering into the conductive electrode layer, and accordingly forms a shielding surface that prevents the conductive electrode layer from being directly visually perceived by a user. The conductive electrode structure also avoids side etching of the conductive electrode layer to ensure increased yield rate.