Abstract: A resin composition and the uses of it are provided. The resin composition comprises: (A) a polyfunctional vinyl aromatic copolymer; and (B) a diene compound, represented by the following formula (I) wherein, in formula (I), R10 and R11 are independently H, a C1-C6 linear or branched alkyl, with the proviso that R10 and R11 are not simultaneously H; and the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.

Abstract: A metal-clad laminate, a printed circuit board using the same and a method for manufacturing the metal-clad laminate. The metal-clad laminate comprises: a first dielectric layer, comprising a first dielectric material and not comprising a reinforcing fabric, the first dielectric material comprising 20 wt % to 60 wt % of a first fluoropolymer and 40 wt % to 80 wt % of a first filler; a second dielectric layer disposed on one side of the first dielectric layer and comprising a reinforcing fabric and a second dielectric material formed on the surface of the reinforcing fabric, wherein the thickness of the reinforcing fabric is not higher than 65 ?m and the second dielectric material comprises 55 wt % to 100 wt % of a second fluoropolymer and 0 to 45 wt % of a second filler; and a metal foil disposed on the other side of the second dielectric layer that is opposite to the first dielectric layer.

Abstract: A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

Abstract: A fluororesin composition is provided. The fluororesin composition comprises the following constituents: (A) a first fluororesin, which is polytetrafluoroethylene (PTFE) resin; (B) a first filler, which is a flat glass fiber; and (C) particles of a second fluororesin, which are coated with polysiloxane, wherein, the particle size of the polysiloxane-coated particles of second fluororesin ranges from 0.2 ?m to 80 ?m, and the melting point of the second fluororesin is lower than the melting point of the first fluororesin.

Abstract: A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), wherein R1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.

Abstract: A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

Abstract: A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.

Abstract: A resin composition is provided.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.

Abstract: A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), (B-2) a repeating unit of formula (II), and (B-3) a repeating unit of formula (III), R1 to R22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

Abstract: A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

Abstract: A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I): (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, R1 in formula (I) is a C6 to C16 alkyl or a C6 to C16 alkenyl, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

Abstract: A halogen-free low dielectric resin composition is provided.

Abstract: A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): in formula (I), t is an integer ranging from 2 to 6, wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

Abstract: A resin composition comprising the following constituents: (A) a polyphenylene ether resin with unsaturated end groups; (B) a constituent with a maleimide structure; (C) a first initiator, which has a first one-minute half-life temperature; and (D) a second initiator, which has a second one-minute half-life temperature, wherein the first one-minute half-life temperature is 20° C. to 50° C. higher than the second one-minute half-life temperature, and the first one-minute half-life temperature is 170° C. to 220° C.

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.

Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.

Abstract: A solvent-free resin composition is provided. The solvent-free resin composition includes: (A) an epoxy resin component, including at least two multi-functional epoxy resins, each of which has at least three epoxy groups in a molecule; (B) an epoxy resin hardener; and (C) inorganic fillers, including a hollow filler and a non-hollow spherical filler, wherein the weight ratio of the hollow filler to the non-hollow spherical filler is from 1:5 to 6:1.