Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A photosensitive resin composition and a method of forming a positive resist pattern by the use of the composition are disclosed. The photosensitive resin composition comprises (A) a resinous compound containing an acid-decomposing ester group, (B) a compound containing one ethylenically unsaturated bond in its molecule and possessing a group capable of forming a carboxylic acid via decomposition by the action of an acid, (C) a photo-acid generator, (D) a photo-radical polymerization initiator, and optionally (E) an epoxy resin.

Abstract: There is provided a photo-curable, electrically conductive composition which is capable of forming a lower layer (black layer) electrode circuit satisfying both the sufficient conductivity and blackness after calcination in the formation of an electrode on a front substrate of a plasma display panel (PDP). The composition comprises, in the first fundamental mode thereof, (A) electrically conductive black fine particles having a specific surface area of more than 20 m2/g,(B) anorganic binder, (C) a photopolymerizable monomer, and (D) a photopolymerization initiator, and in the second mode further comprises (E) inorganic fine particles besides the above components.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing photosensitive polymer obtained by the reaction of a copolymer of (a) a compound containing an unsaturated double bond and a carboxyl group and (b) an unsaturated double bond-containing compound with (c) a compound containing an unsaturated double bond and an epoxy group, (B) a diluent, (C) a photopolymerization initiator, (D) an inorganic powder, and (E) a stabilizer. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photosensitive composition is in the form of a dry film, the film is laminated on the substrate.

Abstract: A photosensitive resin composition and a method of forming a positive resist pattern by the use of the composition are disclosed. The photosensitive resin composition comprises (A) a resinous compound containing an acid-decomposing ester group, (B) a compound containing one ethylenically unsaturated bond in its molecule and possessing a group capable of forming a carboxylic acid via decomposition by the action of an acid, (C) a photo-acid generator, (D) a photo-radical polymerization initiator, and optionally (E) an epoxy resin.

Abstract: Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing polymer obtained by the reaction of (a) a hydroxyl group-containing polymer with (b) a polybasic acid anhydride and/or (F) a carboxyl group-containing photosensitive polymer obtained by causing the carboxyl group-containing polymer (A) mentioned above to react further with a compound containing a glycidyl group and an unsaturated double bond, (B) a diluent, (C) a photopolymerization initiator, and (D) an inorganic powder. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film.

Abstract: Disclosed is a method for producing a patterned calcined inorganic film such as an electroconducting or insulating (non-conductive) film, particularly a plasma display panel, embracing a calcining step. To produce a patterned calcined inorganic film without inducing warpage, shrinkage of line width, or breakage of patterned lines, a patterned film formed on a substrate with a composition containing a heat decomposable binder and particles of an inorganic material is covered, prior to the calcining step, with a coating film of a heat decomposable resin composition capable of hardening or drying at a temperature lower than the temperature at which the heat decomposable binder is thermally decomposed and further capable of being burned off below the highest temperature of the calcining profile and thereafter the calcining step is performed.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A liquid thermosetting filling composition comprising (A) an epoxy resin assuming a liquid state at room temperature, (B) a phenolic resin assuming a liquid state at room temperature, (C) a curing catalyst, and (D) an inorganic filler is useful as an ink for permanently filling such holes as via holes and through holes in printed circuit boards of a multilayer board or a double-sided board, a sealing compound for IC packages, and the like. This composition is a two-stage thermally curing type. In a method for permanently filling holes in a printed circuit board, the composition is applied to the board so as to fill the holes in the printed circuit board and precured by application of heat. The parts of the precured composition protruding from a surface defining the holes is removed by polishing and then the precured composition is further heated to cause final curing thereof.

Abstract: Disclosed are a photocurable composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photocurable composition.

Abstract: Disclosed is a method for producing a patterned calcined inorganic film such as an electroconducting or insulating (non-conductive) film, particularly a plasma display panel, embracing a calcining step. To produce a patterned calcined inorganic film without inducing warpage, shrinkage of line width, or breakage of patterned lines, a patterned film formed on a substrate with a composition containing a heat decomposable binder and particles of an inorganic material is covered, prior to the calcining step, with a coating film of a heat decomposable resin composition capable of hardening or drying at a temperature lower than the temperature at which the heat decomposable binder is thermally decomposed and further capable of being burned off below the highest temperature of the calcining profile and thereafter the calcining step is performed.

Abstract: Disclosed are a photosensitive composition which is developable with an aqueous alkaline solution and such calcined patterns as a conductor pattern, a vitreous dielectric pattern, and a fluorescent pattern which are obtained by the use of the photosensitive composition. The photosensitive composition comprises (A) a carboxyl group-containing photosensitive polymer obtained by the reaction of a copolymer of (a) an unsaturated double bond-containing acid anhydride and (b) an unsaturated double bond-containing compound with (c) a compound containing a hydroxyl group and an unsaturated double bond, (B) a diluent, (C) a photopolymerization initiator, (D) an inorganic powder, and (E) a stabilizer. The composition may be in the form of paste or in the form of a dry film. When the photosensitive composition is in the form of paste, the paste is applied to a substrate and then dried to form a film. When the photosensitive composition is in the form of a dry film, the film is laminated on the substrate.

Abstract: Disclosed are an alkali development type photocurable conductive paste composition and a plasma display panel having electrodes thereof formed of the composition. The conductive paste composition comprises (A) a copolymer resin resulting from the addition of glycidyl (meth)acrylate to a copolymer of methyl methacrylate with (meth)acrylic acid, (B) a photopolymerization initiator, (C) a photopolymerizable monomer, (D) a powder of at least one conductive metal selected from the group consisting of Au, Ag, Ni, and Al, (E) glass frit, and (F) an acidic phosphorus compound. A fine electrode circuit can be formed on a substrate to be used in the plasma display panel by applying the composition on the substrate, exposing the applied layer to radiation according a prescribed pattern, developing the coating film of the composition with an aqueous alkali solution, and calcining the developed coating film.

Abstract: A photocurable and thermosetting resin composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination: (A) a photosensitive prepolymer soluble in a dilute aqueous alkali solution obtained by esterifying an epoxy resin represented by the following general formula (1) with (meth)acrylic acid and further adding an acid anhydride thereto until an acid value reaches a level in the range of 60 to 120 mg KOH/g, (B) a diglycidyl ether type epoxy compound containing two epoxy groups in the molecular unit thereof, (C) a photopolymerization initiator, and (D) a diluent at such ratios of combination that said epoxy compound (B) accounts for a proportion in the range of 5 to 120 parts by weight and said photopolymerization initiator (C) for a proportion in the range of 0.1 to 30 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A): ##STR1## wherein X represents CH.sub.2, C(CH.sub.3).sub.2, or SO.sub.

Abstract: A composition for the formation of barrier ribs of a plasma display panel and a method for the formation of the barrier ribs are disclosed. The formation of barrier ribs is effected by applying either a composition comprising (A) a low-melting glass having a working point of not more than 560.degree. C.

Abstract: An insulating resin composition for the build-up of multilayer circuits by the procedure of copper foil lamination and a method for the production of a multilayer printed circuit board by the use of the insulating resin composition are disclosed. The insulating resin composition comprises at least one species of epoxy resin having a softening point of not more than 110.degree. C., a monomer or an oligomer possessing an unsaturated double bond, an epoxy resin curing agent, and a photopolymerization initiator. The insulating resin composition is applied to a printed circuit board throughout the entire area thereof so as to cover conductor patterns formed thereon and then irradiated with UV light. Subsequently a copper foil is superposed on the applied layer of the insulating resin composition on the printed circuit board by means of a heated pressure roller to effect lamination thereof.

Abstract: A photocurable and thermosetting coating composition which can be diluted with water is disclosed. This composition comprises a photopolymerizable resin having a number-average molecular weight in the range of from 500 to 50,000 and containing an aprotic ammonium salt-containing moiety in a proportion of from 0.2 to 4.0 mols per kilogram of the resin, a photopolymerization initiator, a thermosetting component, and a diluent. The photopolymerizable resin is obtained by the reaction of a polymer possessing a tertiary amino group with a monocarboxylic acid and a monoepoxy compound either or both thereof possessing a polymerizable unsaturated double bond. As the thermosetting component, at least one member selected from the group consisting of amino resins, cyclocarbonate compounds, blocked isocyanate compounds, and epoxy resins is used. A tack-free coating film is obtained by applying this composition to a printed circuit board and drying the applied layer of the composition.

Abstract: A photocurable and thermosetting matte liquid resist composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound having at least two epoxy groups in the molecular unit thereof, and further (E) a finely pulverized aluminum silicate matting agent in combination with (F) a filler precipitation preventing agent capable of effective thixotropic adjustment in the composition. The composition may further comprise (G) an epoxy resin curing agent. The composition can be advantageously used for the formation of a solder resist on a printed circuit board.

Abstract: A one-package type photosolder resist developable with an aqueous alkali solution and suitable for use as a solder resist for a printed circuit board is disclosed. The composition comprises (A) a copolymeric macromolecular compound containing at least one free carboxyl group in the molecular unit thereof or (A') a copolymeric macromolecular compound containing at least one free carboxyl group and at least one photoreactive unsaturated group in the molecular unit thereof and assuming a solid state at normal room temperature, (B) a diluent including a polyfunctional unsaturated compound assuming a liquid state at normal room temperature and/or an organic solvent, (C) a photopolymerization initiator, (D) a vinyltriazine compound or a derivative thereof, and (E) an inorganic filler.