Abstract: A thermosetting resin composition includes a hydroxy group-containing fluorocarbon resin, an isocyanate compound having two or more isocyanate groups, and a rutile titanium oxide, in which the mass ratio of the fluorocarbon resin to the isocyanate compound is 1 or more and 20 or less, and the mass ratio of the rutile titanium oxide to the fluorocarbon resin is 1.4 or more and 4 or less. In addition, when elemental analysis by the combustion method is performed on a cured product obtained by curing the thermosetting resin composition, ashes at a content of 45% by mass or more, fluorine atoms at a content of 3% by mass or more, and nitrogen atoms at a content of 0.1% by mass or more are detected when the total is defined as 100% by mass.

Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering.

Abstract: Provided is a matte-like cured coating film that is provided on a substrate such as a wiring boar, in which scratches are unnoticeable. The cured coating film is a cured coating film of a curable resin composition provided on the substrate. The cured coating film satisfies Gs (20°)?5 and Gs (85°)?35 and has a ratio R represented by the formula R={Gs (85°)/Gs (60°)}/{Gs (60°)/Gs (20°)} ranging from 0.35 to 4.0, where Gs (20°), Gs (60°), and Gs (85°) are 20° gloss, 60° gloss, and 85° gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

Abstract: [Problem] Provided is a two-component type curable resin composition that allows a mixture of an A agent and a B agent to have excellent dispersibility and printability, causes no visible-copper phenomenon, and provides an excellent packing form (receivability) for transportation. [Solution] A two-component type curable resin composition according to the present invention is characterized by including: an A agent containing a carboxyl group-containing resin; and a B agent containing a thermosetting ingredient, wherein the A agent has a viscosity value in the range of 50 dPa·s or more and 200 dPa·s or less at 25° C. at 5 rpm, wherein the B agent has a viscosity value in the range of 100 dPa·s or more and 300 dPa·s or less at 25° C.

Abstract: Provided is an insulating film for electronic components which can attain a good matte feeling and has excellent visibility of a marker. The insulating film for electronic components is an insulating film for electronic components having a front surface and a back surface, in which a maximum peak height Rp (?m) and the maximum valley depth Rv (?m) of the front surface satisfy the following relational expressions: 0.5?Rv/Rp?2 and 1?Rp+Rv?4. It is also an insulating film for electronic components, in which the 85° gloss Gs (85°) and the 60° gloss Gs (60°) of the front surface satisfy the following relational expression: Gs (85°)?2Gs (60°); and Gs (85°) is 70 or more and Gs (60°) is 30 or less.

Abstract: Provided is a curable resin composition that has excellent heat resistance and low warpage and is, furthermore, capable of improving light transmittance in cured products, a dry film and its cured product of, and an electronic component containing the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a thermosetting resin, (C) a thermosetting accelerator and (D) inorganic particles, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 1000; a dry film and its cured product; and an electronic component containing the cured product were obtained.

Abstract: Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Abstract: To provide a curable resin composition, from which a cured product having high heat resistance, a low dielectric loss tangent, high adhesion to a conductor can be obtained. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are to be provided. A curable resin composition containing (A) an epoxy resin and (B) a compound having an active ester group is obtained, which has ratio of the total amount of epoxy group(s) in (A) the epoxy resin/the total amount of active ester group(s) in (B) the compound having an active ester group in the composition in the range of 0.2 to 0.6. A dry film, a resin-clad copper foil, a cured product, and an electronic component containing the curable resin composition are also obtained.

Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering.

Abstract: [Problem to be Solved] Provided are a curable composition free from prior art shortcomings, having an excellent reflectance, yellowing properties, solder heat resistance, and crack resistance; a cured product of the curable composition and an electronic component having the cured product. [Solution] A curable composition including (A) a white colorant, (B) a photopolymerization initiator, (C) a di- or higher functional (meth)acrylate monomer having a heterocycle, and (D) a thermosetting compound; a cured product thereof; and an electronic component having the cured product were obtained.

Abstract: Provided are a curable composition for inkjet, which not only allows surface curability in formation of a coating film by an inkjet system to be enhanced, but also is not reduced in characteristics conventionally provided, such as solder heat resistance and gold plating resistance, and a cured product and a printed wiring board using the curable composition. The curable composition for inkjet of the present invention includes (A) an alkylene chain-containing bifunctional (meth)acrylate compound, (B) an ?-aminoalkylphenone-based photopolymerization initiator, and (C) an acylphosphine oxide-based photopolymerization initiator, wherein, when the thickness is 10 ?m, the absorbance at a wavelength of 365 nm is 0.08 to 0.8 and the absorbance at a wavelength of 385 nm is 0.05 to 0.3.

Abstract: Provided is a curable resin composition which can be suitably used as a hole filling material for a printed wiring board having excellent characteristics such as noise suppression and a high flexibility in wiring formation. A curable resin composition comprising at least a curable resin and a magnetic filler, wherein the viscosity of the curable resin composition is 100 to 3000 (dPa·s) at 5.0 rpm as measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011, and a cured product obtained by curing the curable resin composition at 150° C. for 30 minutes has an insulation resistance value of 1.0×105? or more.

Abstract: Provided is a curable composition for inkjet printing that has an excellent curing performance at surface point and an excellent curing performance at deep point. The curable composition for inkjet contains (A) an oxime ester-based photopolymerization initiator and (B) an amino group-containing (meth)acrylate compound.

Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing for obtaining a cured product excellent in heat resistance, adhesion to a substrate, and hardness. [Solution] The curable composition for inkjet printing comprises (A) a multi-branched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound.

Abstract: Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V2/V1 in the range of 5.0×10?2 to 1.0×102, wherein V1 (dPa·s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V2 (dPa·s) is the minimum value of the melt viscosity measured at 60° C. to 100° C.

Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.

Abstract: Provided are a curable composition for inkjet, which not only allows surface curability in formation of a coating film by an inkjet system to be enhanced, but also is not reduced in characteristics conventionally provided, such as solder heat resistance and gold plating resistance, and a cured product and a printed wiring board using the curable composition. The curable composition for inkjet of the present invention includes (A) an alkylene chain-containing bifunctional (meth)acrylate compound, (B) an ?-aminoalkylphenone-based photopolymerization initiator, and (C) an acylphosphine oxide-based photopolymerization initiator, wherein, when the thickness is 10 ?m, the absorbance at a wavelength of 365 nm is 0.08 to 0.8 and the absorbance at a wavelength of 385 nm is 0.05 to 0.3.

Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

Abstract: Provided are an electroconductive composition capable of affording a conductor having excellent stretchability and excellent electrical resistance stability; a conductor obtained from the electroconductive composition; and a flexible printed wiring board including a patterned conductor formed using the electroconductive composition. It is an electroconductive composition or the like containing: at least one selected from a block copolymer and a functional group-containing elastomer; and a chain-like silver powder in the form of aggregate particles into which microparticles have aggregated, in which the chain-like silver powder has a tap density of 2.0 g/cm3 or less. The block copolymer is preferably a block copolymer represented by the below-mentioned formula (I): X1—Y—X2??(I) (wherein, X1 and X2 independently represent a polymer unit having a glass transition point Tg of 0° C. or more; and Y represents a polymer unit having a glass transition point Tg of less than 0° C.).

Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.