Abstract: According to the present invention, a metal paste comprising an organo- or inorganometallic compound of a metal that is a solid at ordinary temperature and belongs to group 3 through 15 of the periodic table, and an amino compound as medium, and which exhibits coatable viscosity, is provided. By using the metal paste, metal films of various types of metals or alloys can be formed inexpensively with an industrially simple process and apparatus even on various types of general-purpose, inexpensive substrates having a low softening point such as a glass, plastic, film and so forth, in addition to a ceramic substrate. In particular, the metal film can be formed easily in an ordinary pressure onto a printed wiring board or a substrate to be coated with a metal, which has a poor heat resistance.