Abstract: Vacuum processing equipment capable of preventing particles from sticking to objects to be processed in vacuum vessels. The vacuum equipment comprises a series of vacuum vessels separated by doors, and the pressure in the vessels are reducible respectively. The vessels are so configured that objects to be processed are movable among them, and there is provided light projection means for projecting ultra rays on gases introduced to at least of the vessels.

Abstract: An electrified object contact material characterized in that an oxide film formed in a high purity oxidizing atmosphere with a thickness from several tens to 100 .ANG. is formed at least in a section directly contacting an electrified object. By using the contact component according to the present invention, the electric potential of a wafer can always be suppressed to 50 V or less, and moreover, contamination of a wafer (especially by a metallic material) can completely be eliminated.

Abstract: A neutralizing apparatus is provided to facilitate and efficiently implement electric charge removal from a charged body such as a wafer which is easily charged. When the easily charged body such as a wafer is transported in a housing, a neutralizing charge generator, typically light sources for projecting exciting ultraviolet rays into the housing, are operated. Accordingly, the housing is filled with ions and a gas such as non-reactive gas. The neutralizing charge generator can generate positive or negative ions and electrons. When the charged body is positively charged, the electrons or negative ions move toward the charged body to neutralize the charged body with positive charge. When the charged body is negatively charged, positive ions move toward the charged body to neutralize the negative charge.

Abstract: An apparatus which can neutralize charge bodies such as processed substrates for semiconductor device and for flat display, free from electromagnetic noise, impurity contamination, and residual potentials. To process in a prescribed way a wafer(5) to be processed, the wafer(5) is, for example, moved from a pretreatment chamber(2) to a low pressure reaction chamber(3). In this case, a gas, which does not react on the wafer, such as nitrogen and argon, is introduced into the pretreatment chamber(2), and is kept under a predetermined pressure by a vacuum pump(15). Then, ultraviolet rays are projected in the pretreatment chamber(2) from an ultraviolet rays lamp(11) constituting a means for generating neutralization charge, and positive and negative floating charged particles(electrons and positive ions) are generated by exiting the atmosphere in the chamber(2).

Abstract: A liquid cooled cooling device wherein occurrence of vibrations is controlled, the power for feeding water is lowered, and further, temperature variations around a heat generating section are prevented.

Abstract: This invention intends to provide an apparatus-cooling system high in cooling efficiency and easy in maintenance as well as a method to cool an apparatus. The invention is characterized in that an apparatus-cooling water system comprising at least a water tank (1) for storing pure water, pipings (3), (5) for outwardly introducing pure water from the water tank and returning the water to the tank, respectively, and pump (2) for passing pure water through the pipings is provided with an ozonator (6) for supplying ozone into the pure water.