Abstract: A method for contacting and packaging a semiconductor chip of a power electronic component. The power electronic component has a first contact face produced in a first step via a multi-material printing process and a semiconductor chip, which is placed in a second step onto the first contact face. A ceramic insulation layer, which surrounds the semiconductor chip along its circumference and extends over the first contact face not covered by the semiconductor chip, is printed in a third step onto the first contact face. A second contact face is printed in a fourth step onto the ceramic insulation layer and the semiconductor chip. In a fifth step, the power electronic component is sintered by means of heat treatment.

Abstract: A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

Abstract: The invention describes a device for emitting or detecting electromagnetic radiation. The device has a first and a second electrode which are connected to each other via an electrically conductive nanostructure. The electrically conductive nanostructure is configured to receive electrons and holes from the first and second electrode or transport same to the first and second electrode. In addition, the device has a radiation molecule arranged at a circumferential surface of the electrically conductive nanostructure. The radiation molecule is configured to absorb electrons and holes or electromagnetic radiation and emit the electromagnetic radiation with recombination of electrons absorbed and holes absorbed, or emit electrons and holes based on the electromagnetic radiation absorbed.

Abstract: A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.

Abstract: The invention describes a device for emitting or detecting electromagnetic radiation. The device has a first and a second electrode which are connected to each other via an electrically conductive nanostructure. The electrically conductive nanostructure is configured to receive electrons and holes from the first and second electrode or transport same to the first and second electrode. In addition, the device has a radiation molecule arranged at a circumferential surface of the electrically conductive nanostructure. The radiation molecule is configured to absorb electrons and holes or electromagnetic radiation and emit the electromagnetic radiation with recombination of electrons absorbed and holes absorbed, or emit electrons and holes based on the electromagnetic radiation absorbed.

Abstract: A fluidic actuator includes a basic arrangement having at least one cavity formed therein, an activatable substance within the cavity, and a deformable seal arrangement. The activatable substance, exemplarily an electrolyte, may be converted, at least partly, by suitable activation and thus cause a change in pressure in the cavity. The deformable seal arrangement serves for sealing the cavity. The seal arrangement includes an element containing paraffin and may be deformed when activating the activatable substance due to the change in pressure of the activatable substance. A corresponding method of manufacturing includes the following steps: providing the basic arrangement; forming a cavity, which is open on at least one side, in the basic arrangement; introducing the activatable substance into the cavity; and sealing the cavity using the deformable seal arrangement which includes an element containing paraffin.

Abstract: A method for producing a substrate with a copper or a copper-containing coating is disclosed. The method comprises a first step wherein a first precursor, a second precursor and a substrate are provided. The first precursor is a copper complex that contains no fluorine and the second precursor is selected from a ruthenium complex, a nickel complex, a palladium complex or mixtures thereof. In the second step, a layer is deposited at least on partial regions of a surface of the substrate by using the first precursor and the second precursor by means of atomic layer deposition (ALD). The molar ratio of the first precursor:second precursor used for the ALD extends from 90:10 to 99.99:0.01. The obtained layer contains copper and at least one of ruthenium, nickel and palladium. Finally, a reduction is performed step in which a reducing agent acts on the substrate obtained after depositing the copper-containing layer.

Abstract: A switchable coupling with a coupling system between a driving element and an output element is provided. The switchable coupling includes an actuator, an elastic actuating element and a switching element movable between starting, central and end positions. In the central position the switchable coupling has a different state (open or closed) than in the starting position. The switchable coupling further includes a bolt constrained between first and second bolt stops. Axial movement of the switching element causes operative surfaces connected to the switching element or the bolt to engage with elements on other of the switching element and the bolt, such that the bolt rotates relative to the switching element. The bolt alternately moves relative to the switching element into a first relative position blocking switching element movement in the central position, and into a second relative position permitting movement of the switching element toward the starting position.

Abstract: A switchable coupling, in particular for vehicle auxiliary assemblies, is provided. The coupling includes an actuating system actuated electrically, mechanically, pneumatically or hydraulically between a driving element and an output element, and a switching element movable between switching start and end positions counter to the force of one or more resetting elements upon actuation of the actuating system. In the end position, the switching element connects the driving and output elements such that the output element and an auxiliary coupling connected thereto rotate with the driving element. After deactuation, locking bodies located on the auxiliary coupling produce an connection between the driving and output elements which continues to conduct torque between the driving and output elements. The connection is interrupted only when the rotational speed of the driving element falls below a limit value. The coupling does not require a permanent supply of power in the open or closed state.

Abstract: A fluidic actuator includes a basic arrangement having at least one cavity formed therein, an activatable substance within the cavity, and a deformable seal arrangement. The activatable substance, exemplarily an electrolyte, may be converted, at least partly, by suitable activation and thus cause a change in pressure in the cavity. The deformable seal arrangement serves for sealing the cavity. The seal arrangement includes an element containing paraffin and may be deformed when activating the activatable substance due to the change in pressure of the activatable substance. A corresponding method of manufacturing includes the following steps: providing the basic arrangement; forming a cavity, which is open on at least one side, in the basic arrangement; introducing the activatable substance into the cavity; and sealing the cavity using the deformable seal arrangement which includes an element containing paraffin.

Abstract: A method can be used for the production of a coated substrate. The coating contains copper. A copper precursor and a substrate are provided. The copper precursor is a copper(I) complex which contains no fluorine. A copper-containing layer is deposited by means of atomic layer deposition (ALD) at least on partial regions of the substrate surface by using the precursor. Optionally, a reduction step is performed in which a reducing agent acts on the substrate obtained in the layer deposition step. In various embodiments, the precursor is a complex of the formula L2Cu(X?X) in which L are identical or different ?-donor-? acceptor ligands and/or identical or different ?,?-donor-? acceptor ligands and X?X is a bidentate ligand which is selected from the group consisting of ?-diketonates, ?-ketoiminates, ?-diiminates, amidinates, carboxylates and thiocarboxylates.

Abstract: A method for producing a substrate with a copper or a copper-containing coating is disclosed. The method comprises a first step wherein a first precursor, a second precursor and a substrate are provided. The first precursor is a copper complex that contains no fluorine and the second precursor is selected from a ruthenium complex, a nickel complex, a palladium complex or mixtures thereof. In the second step, a layer is deposited at least on partial regions of a surface of the substrate by using the first precursor and the second precursor by means of atomic layer deposition (ALD). The molar ratio of the first precursor:second precursor used for the ALD extends from 90:10 to 99.99:0.01. The obtained layer contains copper and at least one of ruthenium, nickel and palladium. Finally, a reduction is performed step in which a reducing agent acts on the substrate obtained after depositing the copper-containing layer.

Abstract: A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures.

Abstract: The invention relates to a micromechanical sensor having at least two spring-mass damper oscillators. The micromechanical sensor has a first spring-mass-damper oscillating system with a first resonant frequency and a second spring-mass-damper oscillating system with a second resonant frequency which is lower than the first resonant frequency. The invention also relates to a method for detection and/or measurement of oscillations by means of a sensor such as this, and to a method for production of a micromechanical sensor such as this. The first and the second spring-mass-damper oscillating systems have electrodes which oscillate in a measurement direction about electrode rest positions with electrode deflections which are equal to or proportional to deflections of the spring-mass-damper oscillators.

Abstract: A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures.