Patents Assigned to Technoplas, Inc.
  • Patent number: 4889667
    Abstract: A method for the supervision of injection molding including monitoring an internal die pressure of molten resin flowing through a resin passageway in a mold to form a monitored waveform; displaying the monitored wavefrom together with a predetermined reference waveform on a display unit such as a CRT, and comparing the monitored waveform with an allowable value of the reference waveform to determine any abnormality caused in a molding process. The injection molding can be supervised with accuracy on the basis of the reference waveform representing the optimum internal die pressure, thereby increasing the quality of molded articles.
    Type: Grant
    Filed: May 21, 1987
    Date of Patent: December 26, 1989
    Assignee: Technoplas Inc.
    Inventors: Hisashi Kojima, Tatsuo Miyagi
  • Patent number: 4797236
    Abstract: A method for injection molding a material involving bringing the interior of a tightly sealed injection mold under a high vacuum, then injecting the material into the interior of the injection mold at an ultrahigh speed in the vicinity of a speed at which adiabatic change is exerted on the material in accordance with a predetermined pattern of internal pressure so as to fill the interior of the injection mold with the material, and molding the material under low pressure. An injection molding apparatus used for carrying out the aforementioned method is capable of bringing the interior of the injection mold to a high vacuum.
    Type: Grant
    Filed: December 18, 1985
    Date of Patent: January 10, 1989
    Assignee: Technoplas, Inc.
    Inventor: Hisashi Kojima
  • Patent number: 4744740
    Abstract: A straight-hydraulic mold clamping system for use in a molding machine has a bearing portion for a rod of a mold clamp cylinder provided with a plurality of annular oil grooves within which an oil functions, and utilizes the rigidity of the rod so as to horizontally support a movable platen and a molding die attached to the movable platen in a cantilever manner and maintain the horizontality of the movable platen and the molding die.
    Type: Grant
    Filed: November 22, 1985
    Date of Patent: May 17, 1988
    Assignee: Technoplas, Inc.
    Inventor: Hisashi Kojima