Patents Assigned to TECT Corporation
  • Solder applying method and solder applying apparatus
    Publication number: 20040164131
    Abstract: An electronic component 10 is moved along a predetermined path in a first direction D1 by a work conveying unit 16. From a second direction substantially orthogonal to the first direction, a solder material is applied, by injection, to lead terminals 11 of the electronic component by a solder supply unit 14. While the applied solder material is in a molten state, a high-temperature fluid is sprayed to the lead terminals by a fluid spray unit 15. It is desirable that the direction of spraying of the high-temperature fluid is adjustable.
    Type: Application
    Filed: February 26, 2004
    Publication date: August 26, 2004
    Applicant: TECT Corporation
    Inventor: Haruo Watanabe