Abstract: In a tape extension device for a semiconductor producing apparatus having a vertical tension device for tensing a tape, which is withdrawn from a tape roller, in a down-web direction above a semiconductor wafer, the tape extension device in the present invention comprises a lateral tension device. The lateral tension device includes clamp means for clamping an edge of a side of the tape in a cross-web direction which tape is extended in the down-web direction by means of the vertical tension device, another clamp means for clamping another edge of the tape, and drive means for opening and closing both of the clamp means in the cross-web direction.

Abstract: A method of supporting a wafer comprising the steps of: dividing a pressure space formed between the table plate and the wafer into a first pressure space and a second pressure space by means of a pressure setting wall, setting a supporting pressure of a compressed air supplied to the first pressure space, by a throttle function of a throttle passage formed between a pressure regulating wall and the wafer, and determining a further supporting pressure of the compressed air supplied from the first pressure space to the second pressure space through the throttle passage, by a throttle function of a throttle opening for connecting the second pressure space with the atmosphere. A wafer supporting apparatus for carrying out the method and a wafer mounter having the apparatus.

Abstract: A method of cutting off a masking film of a silicon wafer comprising the steps of rotating the silicon wafer, feeding a heat wire continuously to the outer periphery of the silicon wafer and cutting off the outer periphery of the masking film along the outer perphery of the silicon wafer.