Abstract: In the manufacturing process for a printed wiring board a photopolymer insulation layer having a flat outer plateau surface is extended from the board substrate surface carrying the wiring pattern and provides access channels to a plurality of wiring pattern conductor pad areas. A patterned conductor layer disposed on the insulation layer surface including the sidewalls of the access channels thus electrically connects to the conductor pad areas. Circuit wiring pattern test current or plating currents are passed through the conductor layer pattern during the manufacturing process, and the conductor layer may thereafter be easily removed from the flat surface by sanding or the like. Permanently retained conductor layer portions, such as feasible by indenting the plateau surface, aid in expanding conductor surface areas at solder joint pads, or in increasing the density of circuit wires feasible in a given substrate board area.