Abstract: The present invention discloses a housing structure having a conductive adhesive antenna and the conductive adhesive antenna thereof, wherein the housing structure having the conductive adhesive antenna comprises a housing and an electrically conductive adhesive. The housing has two units which can be integrated with each other to form a bonding portion. The electrically conductive adhesive is bonded on the bonding portion and has at least one electrical connection end for electrically connecting with a wireless module, thereby the electrically conductive adhesive is also formed as an antenna structure. With the implementation of the present invention, the conductive adhesive antenna can replace a prior antenna.

Abstract: The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.

Abstract: The present invention discloses a form-in-place conductive and waterproof colloid, being composed of: dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; hydroxy terminated polydimethylsiloxane; dispersant; dimethyl, methylhydrogen siloxane crosslinking agent; adhesion promoter; Pt catalyst; forming agent; hydrocarbon solvent; Nickel Graphite; thickening agent; Trimethylated silica; and inhibitor. With the implementation of the present invention, no production mold or die cutter is required to simplify the process of applying the colloid and reduce the cost of applying, and with the characteristics of being providing waterproof and dustproof capability for enclosures, providing excellent adhesion capability, providing excellent compressibility and resilience, isolating EMI and providing EMI shielding capability at the same time.