Abstract: A mounting bracket for an electronic flight bag (EFB) includes a frame having a track and a mounting assembly that is having a base and a support that is moveably connected to the base and can be selectively fixed in position on the track. The mounting bracket may allow for singlehanded adjustment of the position of the mounting assembly with respect to track at one of at least two discrete locations along the track, or at any desired position along the track. Further, the mounting bracket may provide a single mechanism for both securing the EFB to the mounting assembly and orienting the support with respect to the base.

Abstract: An integral bonding attachment includes an insulated section of a conductive wire with an exposed, uninsulated section. A sleeve covers the insulated and uninsulated sections of the conductive wire, and the sleeve includes a flattened section encasing at least a portion of the uninsulated wire section to form a generally integral structure with the core of the conductive wire. At least one generally tubular section is positioned at an end of the flattened section to engage the insulated section of the conductive wire. An aperture may pass simultaneously through the inner core and flattened sleeve section for attaching the integral bonding attachment to a structure.

Abstract: A connector assembly includes a signal array of a plurality of conductors, each conductor including at least one inner conductive element and an outer conductive element. A connector body has a front surface and the inner and outer conductive elements are electrically presented proximate the front surface in a generally co-planar arrangement. The inner and outer conductive elements terminate in a face surface that is raised above the front surface of the connector body. A compressible interface element has a plurality of conductive elements embedded in a compressible, electrically insulative medium. The interface element is positionable against the face to be compressed between the signal array and a signal bearing component to pass signals between the signal array and the signal-bearing component.

Abstract: An integral bonding attachment includes an insulated section of a conductive wire with an exposed, uninsulated section. A sleeve covers the insulated and uninsulated sections of the conductive wire, and the sleeve includes a flattened section encasing at least a portion of the uninsulated wire section to form a generally integral structure with the core of the conductive wire. At least one generally tubular section is positioned at an end of the flattened section to engage the insulated section of the conductive wire. An aperture may pass simultaneously through the inner core and flattened sleeve section for attaching the integral bonding attachment to a structure.

Abstract: A fiber-optic cable with low buffer insertion force, significant kink resistance, and improved thermal performance incorporating a dual layer buffer of a low density material beneath a continuous seamless high modulus material without compromising low smoke, toxicity, and flammability.

Abstract: A connector assembly includes a signal array of a plurality of conductors, each conductor including at least one inner conductive element and an outer conductive element. A connector body has a front surface and the inner and outer conductive elements are electrically presented proximate the front surface in a generally co-planar arrangement. The inner and outer conductive elements terminate in a face surface that is raised above the front surface of the connector body. A compressible interface element has a plurality of conductive elements embedded in a compressible, electrically insulative medium. The interface element is positionable against the face to be compressed between the signal array and a signal bearing component to pass signals between the signal array and the signal-bearing component.

Abstract: A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace.